junction coatingとは 意味・読み方・使い方

Subsequently, the polishing is conducted on the coating layer 23 on the insulation layer 22 under the condition that the polishing speed of the coating layer 23 is adequately quick relative to the junction metal layer 24, thereby causing the junction metal layer 24 to protrude on a surface of the insulation layer 22.例文帳に追加

続いて、被覆層２３の研磨速度が接合金属層２４に対して充分に速い条件で、絶縁層２２上の被覆層２３を研磨することにより、接合金属層２４を絶縁層２２の表面に突出させる。 - 特許庁

The structure for protecting junction between the diamond surface and the metal piece protects the junction between the diamond surface and the metal piece by providing an Ru coating for covering the entire metal piece and having an area larger than the area of the metal piece, on a non-junction surface between the metal piece and the diamond surface.例文帳に追加

ダイヤモンド表面と金属片との接合を、金属片とダイヤモンド表面の非結合面に、当該金属片を覆いつくす当該金属片より面積の大きいRu被膜を設けることにより保護したダイヤモンド表面と金属片との接合保護構造。 - 特許庁

The antirust/thick-coating waterproofing method 2 is executed on an important junction part of a steel structure 1 as well as the range of 100 mm or more of the circumferences, so as to prevent the harmful materials from penetrating into the junction part.例文帳に追加

鋼構造物１の重要な接合部位を含め、周囲１００ｍｍ以上の範囲を、樹脂系防錆・厚塗り防水構法２を施し、接合部に有害物質の浸透する事を防ぐ。 - 特許庁

The junction part 2, where the end part of the junction part extends straight, is inserted between the braid 30 of the shield wire and an insulation coating 20 that is located below the braid.例文帳に追加

接合部の端部がまっすぐに延伸した接合部２をシールド線の編組３０と編組の下に位置する絶縁被膜２０との間に挿入する。 - 特許庁

SOLID POLYMER ELECTROLYTE, AND FILM, SOLUTION FOR COATING ELECTRODE CATALYST, FILM/ELECTRODE JUNCTION AND FUEL BATTERY USING THE SAME例文帳に追加

固体高分子電解質、それを用いた膜、電極触媒被覆用溶液、膜／電極接合体及び燃料電池 - 特許庁

The substrate is thermally processed at a predetermined temperature to form a p-n junction by dispersing phosphorus from the film 2 and form an antireflection coating comprising the film 2.例文帳に追加

基板１を所定の温度で熱処理して、膜２からリンを拡散してｐｎ接合を形成するとともに、膜２からなる反射防止膜を形成する。 - 特許庁

Next, the junction coating resin is discharged from the tip of the needle 10 to coat an LED chip therewith.例文帳に追加

次に、ニードル１０の先端から上記樹脂を吐出させ、ＬＥＤチップにジャンクションコーティングレジンを塗布する。 - 特許庁

Then, an electrode terminal 1 on which lead free coating 2 is formed is flow-mounted on the substrate for the electronic circuit by lead free solder 3 for junction.例文帳に追加

この電子回路用基板に、鉛フリーの皮膜２を形成した電極端子１を接合用鉛フリーはんだ３によってフロー実装する。 - 特許庁