over packagingとは 意味・読み方・使い方

PACKAGING CONTAINER FORMED WITH SMALL PROJECTIONS OVER ENTIRE FLANGE PART OF LID例文帳に追加

蓋体のフランジ部全体に小突起を形成した包装用容器 - 特許庁

ANTI-BLOWING-OVER BEVERAGE, ANOTHER PACKAGING CONTAINER, TUBE SUCH AS STRAW FOR ANTI-BLOWING-OVER PACKAGING CONTAINER, AND PACKAGING CONTAINER WITH TUBE SUCH AS ANTI-BLOWING-OVER STRAW例文帳に追加

噴きこぼれ防止のための飲料その他のパック容器、噴きこぼれ防止のためのパック容器用のストロー等の管、および噴きこぼれ防止のためのストロー等の管付きパック容器 - 特許庁

The second packaging element 4 formed into a lid shape shallower than a height of the packaged item 2 is applied over the first packaging element 3 and the packaged item 2.例文帳に追加

被包物２の高さより浅い蓋状に形成された第２包装要素４を、第１包装要素３と被包物２とにわたって被せる。 - 特許庁

The product A received by the cone 25 moves down as the cone 25 moves down to reach a lowered position in the packaging bag P, at which the product A moves into the packaging bag P where products A spread over.例文帳に追加

錐体２５から包装袋Ｐ内への降下距離も短くでき、製品Ａが衝撃で割れるという事態を回避することができる。 - 特許庁

To provide a transparent packaging material capable of keeping high oxygen gas barrier properties over a long period of time.例文帳に追加

長期間に亘って高い酸素ガスバリア性を持続できる透明性な包装材料の提供。 - 特許庁

To provide a laminate having excellent tearability, heat sealability and hot tack strength and a packaging bag using the laminate or the packaging bag for filling and packaging dried seasoning for sprinkling on rice, a material of boiled rice with tea poured over it, bath agent or the other various type powders.例文帳に追加

開封性に優れ、ヒートシール性及びホットタック強度に優れた積層体、及びそれを用いた包装袋、特にふりかけ、お茶漬けの素、だしの素、浴用剤その他各種粉末の充填包装用包装袋を提供。 - 特許庁

The packing box comprises a combination of a lidded packaging box for receiving perishable food or the like to be preserved in cold, and a set of upper and lower heat-insulating outer packaging boxes formed in a double-wall structure in a tray form to be put over the packaging box in a butted state.例文帳に追加

保冷を要する生鮮食品等を収める蓋付きの包装箱と、この包装箱に突き合わせ状に覆い被せる為の、トレー状で二重壁構造を備えた、上・下１組の断熱外装箱との組合わせから成る。 - 特許庁

The electronic equipment 10 has: a packaging substrate 11; the electronic component 13 packaged onto the packaging substrate 11; and a resin film 15 provided over the entire surface of the packaging substrate 11 while covering the electronic component 13.例文帳に追加

電子装置１０は、実装基板１１と、実装基板１１上に実装された電子部品１３と、電子部品１３を覆うように、実装基板１１の全面に渡って設けられた樹脂フィルム１５と、を備えている。 - 特許庁