多層貼り合わせの英語

前記の多層樹脂シートの片面又は両面に基材を貼り合わせてなる高熱伝導樹脂シート。例文帳に追加

The high thermal conductivity resin sheet is obtained by laminating a base material on at least one side of the multilayer resin sheet. - 特許庁

そして、前記第１及び第２の多層膜のＳｉＯ２層同士を、フッ化水素酸を含む薬液で反応させ、化学接合により貼り合わせている。例文帳に追加

The SiO_2 layers of the first and the second multilayer films are bonded together with a chemical binding reacted by using a chemical including hydrofluoric acid. - 特許庁

耐熱性や機械的強度と貼り合わせ時の接着性を両立させることができ、多層基板を容易で安価に製造することのできる樹脂フィルムおよびそれを用いた多層基板とその製造方法を提供する。例文帳に追加

To provide a resin film which can simultaneously achieve heat resistance and mechanical strength and the adhesion on laminating and can easily and inexpensively manufacture a multilayer substrate, a multilayer substrate using the same, and to provide a method for manufacturing the multilayer substrate. - 特許庁

本体基板とサブ基板との分断線が安定した基板、および該基板を貼り合わせる多層基板の製造方法ならびに該多層基板を備えた衛星放送受信装置（ＬＮＢ）を提供する。例文帳に追加

To provide a method of manufacturing a substrate in which the dividing line between a main-substrate and a sub-substrate is stabilized and a multilayer substrate in which the substrates are laminated, and also to provide a sattellite broadcast receiver (LNB) provided with the multilayer substrate. - 特許庁

貼り合わせ時の導体パターンの位置ずれ防止と多層化時の樹脂フィルムの接着性確保を両立させることができ、多層回路基板を容易で安価に製造することのできる樹脂フィルムおよびそれを用いた多層回路基板とその製造方法を提供する。例文帳に追加

To provide: a resin film which compatibly achieves both prevention against a position shift of a conductor pattern during sticking and securing of adhesive strength of a resin film during lamination of layers and with which a multilayer circuit board is easily manufactured at low cost; the multilayer circuit board using the same; and a method of manufacturing the same. - 特許庁

そして、フラットケーブル体（１０ａ、１０ｂ）の端末導体露出部（ｔ１、ｔ２）の面を同一面とし、端末部間スペース（ｓ１）を設けて両フラットケーブル体を重ね合わせ、両面テープにて貼り合わせて多層（２層）フラットケーブル（２０）とする。例文帳に追加

The multi-layered (two-layered) flat cable (20) is formed by sticking the flat cable bodies by double-side adhesive tape. - 特許庁

多層積層フィルム２６を貼り合わせ、この貼り合わせ面よりストロー２８を突出させた容器１２を膨張の程度を規制する隙間５０を有した容器保持部１６に挿入し、前記ストロー２８を介して容器１２への加圧と前記容器の内圧の解放とを行う。例文帳に追加

A container 12 having multi-layered films 26 adhered thereto and having a straw 28 protruded out of their adhering surfaces is inserted into a container holding segment 16 having a clearance 50 for restricting a degree of expansion so as to perform a pressurization of the container 12 and releasing of the container through the straw 28. - 特許庁

貼り合わせ前の樹脂フィルムの準備工程が単純で、準備工程における各部材の取り扱いが容易であり、製造コストを抑制できると共に、貼り合わせ後においては接続導体での接続不良が発生し難い多層回路基板の製造方法およびそれによって製造される信頼性の高い安価な多層回路基板を提供する。例文帳に追加

To provide a method of manufacturing a multilayer circuit board, by which any connection failure in a connection conductor is hard to occur after a lamination, while a preparation process of a resin film before the lamination being simple and a handling of each member in the preparation process being easy and a manufacturing cost being able to be suppressed, and to provide a cheap multilayer circuit board with a high reliability manufactured by the method. - 特許庁