平面熱応力の英語

応力緩和部材２０は平面視多角形状をなす高熱伝導性材料のコーナ部Ｃを平面視がラウンド形状をなすように機械的に加工してなるものである。例文帳に追加

The stress reducing member 20 is formed by mechanically working the corners C of a highly thermally conductive material in a polygonal shape in the plane view so as to be rounded in the plane view. - 特許庁

光偏向器において、固定した際の応力或いは熱応力等により基板の支持部との固定箇所がたとえ変形しても、可動部の反射面の平面度（面精度）の低下を防止することである。例文帳に追加

To prevent deterioration in the flatness (profile irregularity) in a reflection area of a movable part, in an optical deflector, even if the fixing part to the support of a substrate is deformed by stress or thermal stress or the like during the fixing. - 特許庁

(i)リング状ゲート端子の電磁誘導による誘導加熱作用を防止或いは格段に軽減すること、(ii)リング状ゲート端子の外周平面に熱応力が働いた場合の塑性変形を防止或いは抑制すること。例文帳に追加

To prevent or suppress induction heating action due to electromagnetic induction and plastic deformation upon application of thermal stress to the outer circumferential surface of a ring-like gate terminal. - 特許庁

凸状部及び凹状部は、熱（温度変化）による薄板体１１と支持部材１２との間の伸縮量差を吸収するように変形し、薄板体１１の平面方向における応力を低減する。例文帳に追加

The convex parts and the concave parts deform so as to absorb the elastic volume difference between the thin plate body 11 and the support member 12 by heat (temperature change), and stress in a flat surface direction of the thin plate 11 is reduced. - 特許庁

半導体チップ５の主平面と封止樹脂１５との間に、半導体チップ５の半導体基板の熱膨張率と封止樹脂１５の熱膨張率の間の熱膨張率をもつ応力調整用樹脂層９を備えている。例文帳に追加

A semiconductor device includes a stress adjustment resin layer 9 having a thermal expansion coefficient between a thermal expansion coefficient of a semiconductor substrate of a semiconductor chip 5 and a thermal expansion coefficient of an encapsulation resin 15 of the semiconductor chip 5 between a principal plane and the encapsulation resin 15 of the semiconductor chip 5. - 特許庁

平面型ディスプレイのスペーサとして使用できる高い電気抵抗を持ち、ディスプレイ製造工程での熱処理においても熱応力が生じにくく、また、ＰＤＰやＦＥＤの排気管用としても使用可能なガラスを提供すること例文帳に追加

To provide glass which has a high electric resistance so as to be used as a planar type display, and in which thermal stress is hard to occur even in heat treatment in a display production process, and which is usable as an exhaust pipe of PDP (plasma display panel) or FED (field emission display). - 特許庁

金属の少なくとも一部を塑性ひずみ発生温度以上に加熱後、室温に冷却されるまで、前記金属を含む平面内で金属を回転させて金属の残留応力低減することを特徴とする金属の疲労強度向上方法。例文帳に追加

This method for improving the fatigue strength in the metal is characterized in that after heating at least a part of the metal to not lower than the plastic strain generating temperature, the residual stress in the metal is reduced by rotating the metal in a plane containing this metal till cooling to a room temperature. - 特許庁