薄葉積層板の英語

耐熱性薄葉紙及びそれからなるプリプレグ並びにプリント基板用積層体例文帳に追加

HEAT-RESISTANT THIN PAPER, PREPREG COMPOSED THEREOF AND LAMINATE FOR PRINTED CIRCUIT BOARD - 特許庁

薄葉紙３と、基材として両面をサンディング処理した熱硬化性樹脂積層板（例えばフェノール樹脂積層板１）とを接着剤２を介して積層一体化し、薄葉紙３の表面をウレタン樹脂系塗料で塗装する。例文帳に追加

Thin paper 3 and a thermosetting resin laminated sheet (e.g.; phenol resin laminated sheet 1), of which both surfaces are subjected to sanding treatment as a substrate material, are integrally laminated through an adhesive 2 and the surface of the thin paper 3 is coated with a urethane resin paint. - 特許庁

薄葉状印刷配線板又は銅張積層板の水平搬送、洗浄若しくは化学処理におけるロール間への落下、巻き込まれるのを防止し、薄葉状印刷配線板又は銅張積層板を容易に水平搬送、洗浄若しくは化学処理可能な洗浄・化学処理装置を提供する。例文帳に追加

To provide a cleaning/chemical processing apparatus capable of horizontally carrying, cleaning or chemically processing a thinned printed wiring board or a copper-clad laminate easily while preventing it from dropping or being caught between rolls. - 特許庁

本発明の目的は、芳香族ポリアミド繊維を用いた積層板用基材の問題であった、耐熱性、耐熱寸法安定性、及び薄葉化の問題を解決し、高密度化が可能で、かつ大容量の情報伝達による積層板の温度上昇にも耐えうる積層板用基材を得ることにある。例文帳に追加

To provide a base material for a laminate, enabling densification, and resisting the temperature increase of the laminate caused by the communication of a large amount of information by solving the problems of heat resistance, heat-resistant dimensional stability and thinning which are the problems of the base material for the laminate using an aromatic polyamide fiber. - 特許庁

過酷な使用条件や、経年変化によっても表面被覆の損傷が少なく耐久性が極めて高い新規なプリント基板用積層体、及び該プリント基板用積層体を形成するためのプリプレグ、並びに該プリプレグに好適に使用できる耐熱性薄葉紙を提供すること。例文帳に追加

To provide a new laminate for printed circuit boards scarcely causing damage of surface coating and having extremely high durability even under severe use conditions or even by the change with year, to provide a prepreg for forming the printed circuit boards and a heat-resistant thin paper which is suitably usable for the prepreg. - 特許庁

過酷な使用条件や、経年変化によっても損傷が少なく、表面平滑性に富み、電気接続信頼性に優れた新規なプリント基板用積層体、及び該プリント基板用積層体を形成するためのプリプレグ、並びに該プリプレグに好適に使用できる耐熱性薄葉紙を提供すること。例文帳に追加

To provide a new laminate for printed board slight in damage even under severe service conditions or after changed with time, rich in surface smoothness and excellent in electrical connection reliability, to provide a prepreg for forming the above laminate, and to provide a heat-resistant tissue paper suitably usable for the above prepreg. - 特許庁

熱硬化性樹脂を含浸して形成されたプリプレグを積層した後、加熱加圧成形してなるプリント基板用積層体であって、該プリプレグのうち、少なくとも最外層に配置されたプリプレグが芳香族ポリアミド繊維からなる耐熱性薄葉紙に熱硬化性樹脂を含浸して形成されたプリプレグである。例文帳に追加

This laminate for printed board is obtained by laminating prepregs each made by impregnating a thermosetting resin followed by hot pressure molding of the resultant laminate; wherein among the prepregs, at least the prepreg located on the outermost layer is made by impregnating the thermosetting resin into heat-resistant tissue paper comprising aromatic polyamide fiber. - 特許庁