被転導性の英語

これにより第一導電性層３と接着層７とが一体的に被転写基板８に熱転写させる。例文帳に追加

Thus, the first conductive layer 3 and the adhesive layer 7 are thermally transferred integrally to the transferred substrate 8. - 特許庁

これにより第一導電性層３と接着層７が一体的に被転写基板８に熱転写させる。例文帳に追加

Thus, the first conductive layer 3 and the adhesion layer 7 are integrally thermally transferred to the substrate to be transcribed 8. - 特許庁

第２導電型半導体結晶層４の活性層３とは反対側の表面に貫通転位欠陥１１が露出し、貫通転位欠陥１１の内表面及びその周囲を、第２導電型半導体結晶層４に対して非オーミックコンタクト性の材料で被覆（被覆部１３）した。例文帳に追加

On the surface of an opposite side to an active layer 3 of a second conduction type semiconductor crystal layer 4, a penetrating dislocation defective 11 is exposed, the internal surface of the penetrating dislocation defective 11 and its periphery are covered with a material (a coating portion 13) which has non-ohmic contact nature to a second conduction type semiconductor crystal layer 4. - 特許庁

導電性パターン３及び被覆膜２が積層された基板１に異方性導電膜４を転写する場合、被覆膜２の開口部２１が矩形状をなすため、開口部２１の角部において異方性導電膜４が基板１又は導電性パターン３に密着できず、気泡６、６、…を生じる。例文帳に追加

When the anisotropic conductive film 4 is to be transferred onto a substrate 1 with a conductive pattern 3 and a coating film 2 laminated, since an aperture 21 of the coating film 2 exhibits a rectangular form, the conductive film 4 cannot be in tight contact with the substrate 1 or the conductive pattern 3 at corners of the aperture 21, resulting in bubbles 6 generated. - 特許庁

このような構成の転写体１０は、導電性膜１４および接合膜３の形成された側が被転写体へ押し付けられると、接合膜３の膜面が被転写体へ接合する。例文帳に追加

When the side, on which the conductive film 14 and the bonding film 3 are formed, of the transfer member 10 having such a structure is pressed against the transfer-receiving member, the film surface of the bonding film 3 is bonded to the transfer-receiving member. - 特許庁

そして、基材１１を被転写体から離反する方向へ引き離すと、接合膜３が被転写体と強固に接合しているため、導電性膜１４は、基材１１から剥離し、接合膜３を介して被転写体へ転写される。例文帳に追加

Thereafter, when the base material 11 is pulled in a direction in which the base material 11 is away from the transfer-receiving member, the conductive film 14 is separated from the base material, and through the bonding film 3, transferred onto the transfer-receiving member because the bonding film 3 is strongly bonded to the transfer-receiving member. - 特許庁

導電箔６０に分離溝５４を形成した後、回路素子を実装し、この導電箔６０を支持基板として絶縁性樹脂５０を被着し、反転した後、今度は絶縁性樹脂５０を支持基板として導電箔を研磨して導電路として分離している。例文帳に追加

Conductive foil is polished with insulating resin 50 as the support substrate and is separated as a conductive path. - 特許庁

導電性支持体上に設ける導電性被覆層を、導電性粒子を分散した層とし、その形成時における層形成用の混合物の攪拌処理を大流量での、低シェア多重パス運転でおこなう。例文帳に追加

As a conductive coating layer to be provided on a conductive support, a layer having conductive particles dispersed therein is formed, and stirring treatment of a layer forming mixture in the formation is performed by low-share multipass operation with high flow rate. - 特許庁