複合材積層板の英語

前記電気回路形成用複合材料が、基材表面に接合されてなる積層板。例文帳に追加

A lamination board is formed by joining the composite material for electric circuit formation to a base surface. - 特許庁

単板積層板１の表面に木質繊維板３を接着積層した複合基材１０の製造方法であって、単板積層板１の表面に未硬化の接着剤２を介して木質繊維板３を積層して複合体４とし、それを２段以上に積み重ねて集積体５とする。例文帳に追加

The manufacturing method is provided for the composite base material 10 in which a wood fiber board 3 is adhered to and laminated on the surface of the veneer laminate 1, wherein the wood fiber board 3 is laminated through an unhardened adhesive 2 on the surface of the veneer laminate 1 to form the composite body 4, which is stacked in two tiers or more to form an assembled body 5. - 特許庁

熱可塑性樹脂、架橋樹脂、架橋複合材料および銅張り積層板の製造方法例文帳に追加

METHODS FOR PRODUCING THERMOPLASTIC RESIN, CROSS-LINKED RESIN, CROSS-LINKED COMPOSITE MATERIAL AND COPPER-CLAD LAMINATE - 特許庁

熱可塑性樹脂、架橋樹脂、架橋複合材料および銅張り積層板の製造方法例文帳に追加

METHODS FOR PRODUCING THERMOPLASTIC RESIN, CURED RESIN, CURED COMPOSITE MATERIAL, AND COPPER CLAD LAMINATE - 特許庁

液晶配向用基材、積層光学補償フィルム、複合偏光板及び液晶表示素子例文帳に追加

BASE MATERIAL FOR LIQUID CRYSTAL ALIGNMENT, MULTILAYER OPTICAL COMPENSATION FILM, COMBINED POLARIZING PLATE, AND LIQUID CRYSTAL DISPLAY ELEMENT - 特許庁

熱可塑性樹脂、架橋樹脂、架橋複合材料および銅張り積層板の製造方法例文帳に追加

METHOD FOR PRODUCING THERMOPLASTIC RESIN, CROSSLINKED RESIN, CROSSLINKED COMPOSITE MATERIAL AND COPPER-CLAD LAMINATED BOARD - 特許庁

合板２上に硬質樹脂板３とＭＤＦ４とをこの順に積層して複合床基材Ａを構成し、該複合床基材Ａ上に突き板５を積層した床材１である。例文帳に追加

A composite floor base material A is constituted by laminating a hard resin plate 3 and MDF 4 in this order on plywood 2, and the floor material 1 is formed by laminating a veneer 5 on the composite floor base material A. - 特許庁

繊維強化樹脂複合材積層板の穿孔方法、及び、該穿孔方法を使用して形成された貫通孔を有する繊維強化樹脂複合材積層板と組付け部材との組付け方法例文帳に追加

METHOD FOR BORING FIBER REINFORCED RESIN COMPOSITE MATERIAL LAMINATED PLATE, AND METHOD OF ASSEMBLING FIBER REINFORCED RESIN COMPOSITE MATERIAL LAMINATED PLATE HAVING THROUGH-HOLE FORMED USING THE BORING METHOD TO ASSEMBLING MEMBER - 特許庁