金属張基板の英語

積層板、プリプレグ、金属箔張積層板、回路基板及びＬＥＤ搭載用回路基板例文帳に追加

LAMINATE, PREPREG, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR MOUNTING LED - 特許庁

積層板、金属張り積層板、回路基板およびＬＥＤ実装基板、並びに積層体の製造方法例文帳に追加

LAMINATE SHEET, METAL-CLAD LAMINATE SHEET, CIRCUIT BOARD AND LED MOUNTING BOARD, AND MANUFACTURING METHOD OF LAMINATE - 特許庁

絶縁性基板の一方の面に金属箔を張り合わせた金属箔張り基板の金属箔部分にスロットを配列、形成して電波放射金属部１１０とし、絶縁性基板をレドーム１２０とする電波放射基板１００を設ける。例文帳に追加

Slots are arranged and formed in a metallic foil part of an metallic foil-stuck insulating substrate, where the metallic foil is stuck to one face of the insulating substrate, to form a radio wave radiation metallic part 110, and a radio wave radiation substrate 100 with the insulating substrate as a radome 120 is provided. - 特許庁

エポキシ樹脂分散体およびそれを用いた銅張り積層板及び銅張り金属基板例文帳に追加

EPOXY RESIN DISPERSION AND ITS COPPER CLAD LAMINATED PLATE AND COPPER CLAD METALLIC SUBSTRATE - 特許庁

ＦＡＸ拡張キットの金属プレートに第１の拡張電子回路基板５３を取り付ける。例文帳に追加

A metal plate of a FAX extension sheet is fitted with a 1st extension electronic circuit board 53. - 特許庁

金属箔付き基板の基板表面に接着剤層を介して光導波路を張り合わせる第１の工程と、金属箔付き基板の金属箔を導体パターン化して電気配線基板を構築する第２の工程を有する光電気複合基板の製造方法である。例文帳に追加

The method of manufacturing the photoelectric composite substrate includes: a first process of sticking an optical waveguide on the substrate surface of a substrate with metal foil via an adhesive layer; and a second process of making the metal foil of the substrate with the metal foil into a conductor pattern to construct an electric wiring board. - 特許庁

硬化性樹脂組成物、プリプレグ、基板、金属箔張積層板、樹脂付金属箔及びプリント配線板例文帳に追加

CURABLE RESIN COMPOSITION, PREPREG, SUBSTRATE, METAL FOIL-CLAD LAMINATED PLATE, METAL FOIL WITH RESIN, AND PRINTED WIRING BOARD - 特許庁

プリント配線板用樹脂組成物、プリプレグ、基板、金属箔張積層板、樹脂付金属箔及びプリント配線板例文帳に追加

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PREPREG, SUBSTRATE, METAL FOIL-CLAD LAMINATE, METAL FOIL WITH RESIN AND PRINTED CIRCUIT BOARD - 特許庁