be brought face to face withとは 意味・読み方・使い方

Each protrusion 25 is provided with a circular vertex edge face brought into contact with the lower face of the glass substrate 19 to be held.例文帳に追加

各突起部２５は、保持対象となるガラス基板１９の下面に接触する円形状の頂部端面を有している。 - 特許庁

A contacting face 128A of a fixed part 128 of the removable frame 120 comes into contact with a face 150A to be brought into contact with.例文帳に追加

着脱フレーム１２０の固定部１２８の当接面１２８Ａが被当接面１５０Ａと当接する。 - 特許庁

The coating layer 57 forms a joining face 53 to be brought into contact with the second block.例文帳に追加

めっき層５７は、第２ブロックと接触する合わせ面５３を形成する。 - 特許庁

A filtration filter 30 is disposed inside the bottom part of the upper vessel 10 to be brought into contact with the bottom face and the inside face, and a weight 40 is placed on the filtration filter 30.例文帳に追加

上段容器１０の底部内に底面及び内側面に接して濾過フィルター３０を配置し、その上に重し４０を載せる。 - 特許庁

The transfer face is brought into contact with a transfer material 30 set on the main face 20a of a substrate 20 to be treated, and the irregular patterns of the transfer face are transferred to the transfer material by the contact of the transfer face with the transfer material.例文帳に追加

転写面は、被処理基板２０の主面２０ａに設けられた転写材３０に接触させられ、転写面の転写材への接触により転写面の凹凸のパターンが転写材に転写される。 - 特許庁

To make an abutting face parallel to a face abutting to the abutting face in a moving element when the moving element is displaced to be brought into contact with the abutting face, and make electric power consumption low.例文帳に追加

可動子を変位させて当接面に当接させる際に可動子における当接面に接触する面と当接面とを平行にでき且つ低消費電力化が可能な半導体マイクロアクチュエータを提供する。 - 特許庁

A wafer W is brought into contact with hydrofluoric acid steam in a closed space defined by a face of a wafer W to be treated (bottom face), an inner wall face 13 of a vessel 12, and a liquid level 15 of a hydrofluoric acid 14 (that is, a hydrofluoric acid evaporation face).例文帳に追加

ウェーハＷの被処理面（下面）と容器１２の内壁面１３およびフッ酸１４の液面（すなわちフッ酸蒸発面）１５による密閉空間においてウェーハＷをフッ酸蒸気に接触させる。 - 特許庁

When the bottom face 7a of the lead electrode 7 of the electronic component 4 is brought into contact with the first contactor 8 to rotate the rotator 10, the second contactor 9 is composed to be brought into contact with the side face 7b of the lead electrode 7 of the electronic component 4.例文帳に追加

第１の測子８に電子部品４のリード電極７の底面７ａを接触させて回転子１０を回転させると、第２の測子９が電子部品４のリード電極７の側面７ｂに接触する構成である。 - 特許庁