electronic heat sealingとは 意味・読み方・使い方

To solve a problem that the heat for making a sealing material melt acts on an electronic component to be stored inside and causes the deterioration of characteristics of the electronic component.例文帳に追加

封止材を溶融させる熱が内部に収容する電子部品に作用して電子部品の特性に劣化を招来させる。 - 特許庁

The connection portions 22 of wiring patterns 2 and bumps 61 of an electronic component are connected to one another by heat-sealing when the electronic component is mounted.例文帳に追加

電子部品の実装時には、各配線パターン２の接続部２２と電子部品の各バンプ６１とが熱融着によって接続される。 - 特許庁

The electronic component inspection device 1 accommodates the electronic components in a vessel 10, seals the electronic components from the external world by hermetically sealing the vessel, and inspects the temperature characteristics of the electronic components by controlling the electronic components to the inspection temperature by the heat conduction means 50.例文帳に追加

電子部品検査装置１は、電子部品を容器１０に収容して、容器を密閉することで電子部品を外界から閉ざし、熱伝導手段５０によって電子部品を検査温度にして電子部品の温度特性を検査する。 - 特許庁

LIGHT AND HEAT CURING COMBINED USE-TYPE RESIN COMPOSITION, LIGHT AND HEAT CURING COMBINED USE-TYPE MOISTURE-PROOF SEALING MATERIAL FOR ELECTRONIC PAPER, ELECTRONIC PAPER, AND METHOD FOR PRODUCING THE ELECTRONIC PAPER例文帳に追加

光及び熱硬化併用型樹脂組成物、電子ペーパー用の光及び熱硬化併用型防湿シール材、電子ペーパー及びその製造方法 - 特許庁

To solve a problem that since the softening/melting point of a glass sealing material for bonding a cover to an insulating substrate is as high as 400°C or thereabout, heat for melting the sealing material acts on an electronic component contained therein to cause deterioration in the characteristics of the electronic component.例文帳に追加

絶縁基体に蓋体を接合させるガラス封止材の軟化溶融温度が400℃程度で高いため、封止材を溶融する熱が内部に収容する電子部品に作用して電子部品に特性劣化を招来させてしまう。 - 特許庁

To provide an epoxy resin sealing material composition which gives a cured product excellent in heat resistance, transparency and mechanical strength and suffering from no discoloration by heat and is useful for sealing various kinds of electronic parts.例文帳に追加

耐熱性、透明性、および機械強度に優れ、さらに加熱による着色も生じない硬化物を与え、各種電子部品の封止に有用なエポキシ樹脂封止材組成物を得ること。 - 特許庁

To provide an epoxy resin composition having high flame retardancy, high-temperature reliability and soldering heat resistance required for sealing materials for electronic parts.例文帳に追加

本発明は、電子部品の封止材料に要求される難燃性、高温信頼性及び半田耐熱性に優れるエポキシ樹脂組成物を提供する。 - 特許庁

To overcome such a problem that heat for melting a sealing material affects and deteriorates characteristics of an electronic part accommodated within a container.例文帳に追加

封止材を溶融させる熱が内部に収容する電子部品に作用して電子部品の特性に劣化を招来させる。 - 特許庁