impression resinとは 意味・読み方・使い方

IMPRESSION CYLINDER USING RESIN LETTERPRESS, AND OFFSET PRESS例文帳に追加

樹脂凸版を用いた圧胴及びオフセット印刷機 - 特許庁

More concretely, a plaster model is produced from the primary impression, the secondary impression is extracted using the tray (50) for the secondary impression for extracting even the gum part from the plaster model, and integral formation is executed with a resin on the basis of the secondary impression.例文帳に追加

さらに具体的には、一次印象から石膏模型を作製し、石膏模型から歯茎部分も採取する二次印象用トレー（５０）を用いて二次印象を採取し、前記二次印象を基にレジンで一体形成する。 - 特許庁

Finally, reformation and the curing of the resin are simultaneously performed by simultaneously performing voltage impression and heating.例文帳に追加

そして、電圧印加と加熱を同時に行って、再化成と樹脂硬化を同時に行う。 - 特許庁

In the resin covered metal tube formed by covering the outer peripheral surface of a metal tube with a resin layer, a rolling processed part consisting of a difference in level having thickness slightly thinner than that of a resin layer or impression or a rolling processed part consisting of a difference in level and impression is formed between a resin layer and a resin layer peeled part.例文帳に追加

金属管の外周面に樹脂層を被着してなる樹脂被覆金属管において、樹脂層と樹脂層剥離部との間に樹脂層より僅かに薄肉の段差部または圧痕、あるいは段差部と圧痕とからなるローリング加工部を設ける。 - 特許庁

This method uses a means which injects or pours resin showing flexible viscosity at a temperature average or higher than this into an elastic impression mold which never loose flexibility at its cooling curing temperature without changing its normal state, cools the resin, releases the cooled and cured resin from the elastic impression mold, and thereafter polymerizes and cures the resin.例文帳に追加

常温以上で流動的粘性を示す樹脂を常態のままその冷却固化温度にて柔軟性を失わない弾性印象型に注入若しくは流し込んで冷却し、冷却固化した樹脂を前記弾性印象型から離型した後、前記樹脂を重合硬化させる手段を用いる。 - 特許庁

To provide an adhesive between an alginate impression material and an impression tray, exhibiting high bonding strength to any tray made of a metal, a resin or a modeling compound and having high operability.例文帳に追加

金属製、レジン製およびモデリングコンパウンド製のいずれのトレーに対しても高い接着力を示し、操作性も良い、アルジネート印象材と印象用トレーとの間の接着剤を提供すること。 - 特許庁

To provide a mold which is free from the occurrence of the impression or scratch caused by the friction of a lead frame with the mold and also from the occurrence of resin burr in a semiconductor device caused by the impression or the scratch.例文帳に追加

リードフレームと樹脂成形金型との擦れ合いに起因する圧痕や擦れ傷が発生せず、圧痕や擦れ傷を原因として半導体装置に樹脂バリが発生することのない樹脂成形金型を提供することを目的とする。 - 特許庁