polishing pressureとは 意味・読み方・使い方

PRESSURE ROLLER FOR APPLYING POLISHING PAD AND APPLYING METHOD OF POLISHING PAD WITH PRESSURE ROLLER IN DOUBLE-SIDED POLISHING DEVICE例文帳に追加

研磨パッド貼着用加圧ローラを備えた両面研磨装置及び研磨パッドの貼着方法 - 特許庁

To implement high pressure polishing and highly precise low pressure polishing in the same polishing apparatus.例文帳に追加

同一研磨装置において高圧研磨と高精度な低圧研磨とを実施できるようにする。 - 特許庁

To provide a polishing device and polishing method that can obtain a high polishing speed even in low-pressure polishing to perform flat polishing.例文帳に追加

低圧研磨においても、高い研磨速度が得られ、平坦研磨を行うことができる研磨装置及び研磨方法を、提供する。 - 特許庁

To maintain polishing pressure almost at a constant level through the entire polishing process.例文帳に追加

研磨工程全体を通じて研磨圧力をほぼ一定に保つ。 - 特許庁

Thus, at the polishing, the polishing sagging due to a pressure distribution of a polishing clock hardly occurs.例文帳に追加

これにより、研磨時、研磨布の圧力分布による研磨ダレが生じにくい。 - 特許庁

DOUBLE SIDED POLISHING DEVICE EQUIPPED WITH PRESSURE ROLLER FOR APPLYING POLISHING PAD, AND APPLYING METHOD OF POLISHING PAD例文帳に追加

研磨パッド貼着用加圧ローラを備えた両面研磨装置及び研磨パッドの貼着方法 - 特許庁

A polishing pressure corresponding to the depth of a recess is calculated by a polishing pressure calculating device 17 so as to obtain a constant polishing rate, a polishing pressure control 18 gives a polishing pressure to a carrier pressing mechanism 12, and a polishing operation is carried out with a calculated polishing pressure.例文帳に追加

一定の研磨速度が得られるように、凹部深さに応じた研磨圧力を研磨圧力演算装置１７にて算出し、研磨圧力制御部１８が、キャリア加圧機構１２に加えるべき研磨圧力を伝え、算出された研磨圧力にて研磨加工を行う。 - 特許庁

PRESSURE ROLLER FOR APPLYING POLISHING PAD AND APPLYING METHOD OF POLISHING PAD WITH PRESSURE ROLLER IN DOUBLE-SIDED POLISHING DEVICE例文帳に追加

両面研磨装置における研磨パッド貼着用加圧ローラ及び加圧ローラによる研磨パッドの貼着方法 - 特許庁