To provide a method and an apparatus where a surface scribe having a depth of around 200 μm is made by CO_2 laser beam irradiation on glass being used as a solar cell substrate and having a thickness of around 5 mm and where dividing is attained by following machine breaking. 太陽電池基板として用いられる板厚5mm程度のガラスにCO2レーザ光照射によって深さ200μm程度の表面スクライブを発生させ、後続の機械ブレークによって割断を実現させる方法及び装置。 - 特許庁