「grid square method」を含む例文一覧(1)
- In this substrate warping correction method, a substrate is divided like a grid, the number of measuring pins to be provided in one square is calculated, and a position where warping of the substrate is corrected is obtained by taking the number and mounting positions of parts into account in measurement of in-circuit tester when the substrate sucked to bring the measuring pins into contact with it stably.
インサーキットテスタ測定時に、基板を吸引して安定して測定ピンを接触させるようにするときにおいて、基板を格子状に区切って、その一格子内に設置される測定ピンの本数を計算し、その本数と部品の実装位置を考慮して、基板の反りの矯正する位置をもとめる。 - 特許庁
- 特許庁
- Copyright © Japan Patent office. All Rights Reserved.
