「singulate」を含む例文一覧(1)
- Then, the rear surface of the wafer 2a is ground to singulate the wafer into chips 2b, and then, rear surface processing such as formation of rear electrodes 9a followed by heat treatment is executed without separating the chips 2b from the supporter 5.
そして、ウエハ２ａの裏面を研削して各チップ２ｂに個片化したあと、チップ２ｂを支持体５から分離せずに、裏面電極９ａ形成などの熱処理を伴う裏面加工を行う。 - 特許庁
- 特許庁
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