three dimensional thinning methodとは 意味・読み方・使い方

METHOD, PROGRAM FOR THINNING THREE-DIMENSIONAL DATA, MANUFACTURE OF PROSTHETIC APPLIANCE FOR DENTISTRY AND THINNING DEVICE OF THREE-DIMENSIONAL DATA例文帳に追加

三次元データの間引き方法、間引きプログラム、歯科用補綴物の製造方法、および三次元データ間引き装置 - 特許庁

To provide a semiconductor package for three-dimensional mounting and a manufacturing method therefor which allow thinning of the semiconductor, and to improve the precision of an interconnect line formed through a sealing resin.例文帳に追加

本発明は三次元実装される半導体パッケージ及びその製造方法に関し、薄型化を図れると共に封止樹脂内を貫通して形成される配線の精度向上を図ることを課題とする。 - 特許庁

To provide a semiconductor device suitable for, especially miniaturization/thinning in three-dimensional packaging of electronic components to a circuit wiring board, and improvement in the connection reliability between double-sided wiring, to provide a method for manufacturing the semiconductor device, and to provide a semiconductor device laminate.例文帳に追加

特に電子部品の回路配線基板への３次元実装における小形／薄形化、両面配線相互間の接続信頼性向上に好適な半導体装置、製法、半導体装置積層体を提供する。 - 特許庁