copper-clad surfaceとは 意味・読み方・使い方

SURFACE-TREATED COPPER FOIL, METHOD FOR MANUFACTURING THE SAME AND COPPER-CLAD LAMINATE例文帳に追加

表面処理銅箔およびその製造方法ならびに銅張積層板 - 特許庁

SINGLE SURFACE PAPER/PHENOL RESIN/COPPER CLAD LAMINATED SHEET例文帳に追加

片面紙フェノール樹脂銅張積層板 - 特許庁

COPPER CLAD LAMINATE, SURFACE TREATED COPPER FOIL USED FOR MANUFACTURING THE SAME, AND PRINTED WIRING BOARD OBTAINED USING THIS COPPER CLAD LAMINATE例文帳に追加

銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 - 特許庁

The clad cable comprises a copper wire 1 as a core, and an aluminum layer 2 formed on an outer circumferential surface of the copper wire.例文帳に追加

コアとなる銅線（１）と、その外周面に形成されたアルミニウム層（２）とを具備してなる。 - 特許庁

The copper-clad laminate sheet includes the surface-treated copper foil adhered to a resin substrate.例文帳に追加

また、前記表面処理銅箔を樹脂基板に張り付けた銅張積層板である。 - 特許庁

METHOD FOR MANUFACTURE OF ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL MANUFACTURED BY THE METHOD, SURFACE-TREATED COPPER FOIL MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL OR SURFACE-TREATED COPPER FOIL例文帳に追加

電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板 - 特許庁

SURFACE-TREATED COPPER FOIL AND MANUFACTURING METHOD THEREFOR, COPPER-CLAD LAMINATED BOARD USING SURFACE-TREATED COPPER FOIL AND MANUFACTURING METHOD THEREFOR, AND PRINTED WIRING BOARD例文帳に追加

表面処理銅箔及びその製造方法、該表面処理銅箔を用いた銅張積層基板及びその製造方法、並びにプリント配線基板 - 特許庁

To obtain a copper-clad laminated sheet which is good in adhesive force with a copper foil, and has an extremely small surface irregularity of the copper foil surface into contact with a resin layer.例文帳に追加

銅箔の接着力が良好で、樹脂層と接する銅箔面の表面凹凸が極めて小さい銅張積層板を得る。 - 特許庁