rapid bonding adhesiveとは 意味・読み方・使い方

TWO-PACK FRACTIONAL COATING-TYPE RAPID CURING AQUEOUS ADHESIVE, AND METHOD FOR BONDING USING THE AQUEOUS ADHESIVE例文帳に追加

二液分別塗布型速硬化性水性接着剤及び該水性接着剤を用いた接着方法 - 特許庁

To provide a porous material bonding method in which the adhesive used is of a solventless type, is rapid-curing, and flame-retardant, can be applied by means of an inexpensive collision mixing type spray machine, and gives bonding having a low-modulus, high-strength adhesion quantity, and excellent antifogging properties.例文帳に追加

接着剤が無溶剤型、速硬化性、かつ難燃性であって、安価な衝突混合型スプレー機で塗工でき、低弾性率、高強度の接着量、フォギング性が優れた多孔質材の接着方法を提供する。 - 特許庁

To provide an adhesive for semiconductor chip bonding which is excellent in storage stability and rapid curability, is high in transparency, and facilitates the recognition of an alignment mark at the time of semiconductor chip bonding, and to provide a non-electroconductive paste and a non-electroconductive film produced by using the adhesive for semiconductor chip bonding.例文帳に追加

貯蔵安定性及び速硬化性に優れ、かつ、透明性が高く、半導体チップボンディング時のアライメントマークの認識を容易なものとする半導体チップ接合用接着剤、該半導体チップ接合用接着剤を用いて製造される非導電性ペースト及び非導電性フィルムを提供する。 - 特許庁

To provide an adhesive composition which allows a fairly rapid curing at a low temperature and stably yields properties such as bonding strength and connection resistance and a circuit connection material, a connection structure of circuit members and a semiconductor device using the adhesive composition.例文帳に追加

低温で十分迅速に硬化処理を行うことができ、接着強度や接続抵抗等の特性を安定的に得ることが可能な接着剤組成物、並びに該接着剤組成物を用いた回路接続材料、回路部材の接続構造及び半導体装置を提供すること。 - 特許庁