英和和英

発音

IPA: /ˌθɜːrmoʊˈsɒnɪkli/

副詞

thermosonically (not comparable)

1. Involving both heat and ultrasonic energy.
   • 1989 January 24, “4,800,178 METHOD OF ELECTROPLATING A COPPER LEAD FRAME WITH COPPER”, in OFFICIAL GAZETTE of the UNITED STATES PATENT AND TRADEMARK OFFICE, volume 1098, number 4, page 1944:

     … rinsing said passivated copper tape; bonding a semiconductor device to said tape; and thermosonically bonding gold wires between said tape and said semiconductor device.

   • 2000, Richard Ulrich, Mohammed Wasef, Jang-hi Im, Phil Garrou, Dan Scheck, “WIREBONDING TO ELECTROLESSLY-METALLIZED COPPER BONDPADS OVER THICK BENZOCLOBUTENE”, in LOW AND HIGH DIELECTRIC CONSTANT MATERIALS: MATERIALS SCIENCE, PROCESSING, AND RELIABILIY ISSUES Procedings of the Fourth International Symposium and THIN FILM MATERIALS FOR ADVANCED PACKAGING TECHNOLOGIES Procedings of the Second International Symposium, The Electrochemical Society, [We have stucied the ability to thermosonically wirebond gold onto Cu/Ni/Au surface metallurgy consisting of 2 μm Cu representing the bondpad followed by 1 to 4 μm electroless Ni and 1 μm Au over 5-20 μm of BCB (CYCLOTENE™) dielectric. page 168]:

     We have studied the ability to thermosonically wirebond gold onto Cu/Ni/Au surface metallurgy consisting of 2 μm Cu representing the bondpad followed by 1 to 4 μm electroless Ni and 1 μm Au over 5-20 μm of BCB (CYCLOTENE™) dielectric.

   • 2025 February 19, Wikipedia contributors, “Compliant bonding”, in English Wikipedia‎, Wikimedia Foundation:

     Thus the beam leaded “chip” eliminated the need to thermosonically bond wires directly onto metallized pads of the fragile silicon chip (as shown in Figure 6).