epoxy resin componentとは 意味・読み方・使い方

ONE-COMPONENT ELASTIC EPOXY RESIN COMPOSITION例文帳に追加

一成分形弾性エポキシ樹脂組成物 - 特許庁

ONE-COMPONENT THERMOSETTING EPOXY RESIN ADHESIVE例文帳に追加

一液加熱硬化型エポキシ樹脂接着剤 - 特許庁

The epoxy resin composition is obtained by compounding an epoxy resin component containing the hydrogenated epoxy resin with a curing agent for the epoxy resin.例文帳に追加

この水素化エポキシ樹脂を含むエポキシ樹脂成分とエポキシ樹脂用硬化剤とが配合されてなるエポキシ樹脂組成物。 - 特許庁

The epoxy resin composition for sealing the LED comprises the following components (A), (B) and (C): component (A): an epoxy resin obtained by hydrogenating an aromatic epoxy resin and having 230-1,000 g/eq.例文帳に追加

下記（Ａ）、（Ｂ）及び（Ｃ）成分を含有する、ＬＥＤ封止材用エポキシ樹脂組成物。 - 特許庁

NEW PHOSPHORUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION HAVING THE EPOXY RESIN AS INDISPENSABLE COMPONENT, AND ITS CURED PRODUCT例文帳に追加

新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物 - 特許庁

EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE例文帳に追加

エポキシ樹脂組成物、封止用エポキシ樹脂組成物及び電子部品装置 - 特許庁

MANUFACTURING METHOD FOR EPOXY RESIN, EPOXY RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE例文帳に追加

エポキシ樹脂用の製造方法、エポキシ樹脂組成物、及び電子部品装置 - 特許庁

The thermosetting resin composition comprises (A) a polyimide resin component, (B) an epoxy resin component and (C) an epoxy curing agent component as essential ingredients where the epoxy resin component (B) comprises a specific epoxy resin.例文帳に追加

本発明にかかる熱硬化性樹脂組成物は、（Ａ）ポリイミド樹脂成分と（Ｂ）エポキシ樹脂成分と（Ｃ）エポキシ硬化剤成分とを必須成分とし、（Ｂ）エポキシ樹脂成分に、特定のエポキシ樹脂を含ませる。 - 特許庁