電気鍍金器の英語

サブミクロンサイズの起伏を有する半導体集積回路機器基板上に銅を電気鍍金で析出させる方法および対応する電気鍍金浴を調製する濃厚液。例文帳に追加

In the deposition of copper on the plate of a semiconductor integrated circuit equipment having the undulation of a submicron siz by the electroplating, a substrate is immersed in an electroplating bath prepared from a concentrated solution containing an effective amount of an ionic copper and a defect reducing agent. - 特許庁

集積回路機器のサブミクロン・サイズの凹凸を埋めて欠陥を少なくし、表面形態を改善する銅の電気鍍金のための組成物と方法を提供する。例文帳に追加

To provide a composition and a method for an electroplating copper which improves a surface state by filling the unevenness of submicron size of integrated circuit equipment to lessen defects. - 特許庁