double whetstoneとは 意味・読み方・使い方

(2) In this double-axis process for grinding the semiconductor wafer, the number of revolutions of the whetstone used for the grinding process is set to 6,000 r.p.m. (3) Moreover, the grinding step is divided into three steps in the double-axis process for grinding the semiconductor wafer.例文帳に追加

（２）半導体ウエハを研削する2軸工程に於いて、研削に使用する砥石の回転数を6,000r.p.mとしたことを特徴とする上記項１に記載の半導体装置の製造法。 - 特許庁

(1) In the method of manufacturing semiconductor device, material, in which grain size of whetstone used for the grinding is small (#4,000) and the bond which supports the abrasive is hard (about two times the bond of the conventional one), is used in the double-axis process for grinding a semiconductor wafer.例文帳に追加

（１）半導体ウエハを研削する2軸工程に於いて、研削に使用する砥石の粒度が細かく(#4,000)かつ砥粒を支持するボンドが硬い(従来比約２倍) 材料を用いたことを特徴とする半導体装置の製造法。 - 特許庁