semicureとは 意味・読み方・使い方

An adhesive 37 in a state of being set up in an adhesive vessel 30 is made heating/vacuum/centrifugal degassing to semicure it, and then the semicured product is discharged with the state of being set up in the adhesive vessel 30, and further is loaded with a chip.例文帳に追加

接着剤容器３０内に接着剤３７を配置した状態で加熱・真空・遠心脱泡を行い、半硬化させた後、その接着剤容器３０内に配置したまま、半硬化状態の接着剤を吐出させ、チップを搭載する。 - 特許庁

In a method for applying a solvent-containing resin compsn. 2 to a continuous moving release film 3 to semicure the formed resin compsn. layer, the release film 3 is provided with a large number of through-holes 4 having a hole size capable of suppressing the dripping of the coated resin compsn. 2.例文帳に追加

連続的に移動する離型フィルム３上に、溶剤入り樹脂組成物２を塗布し、樹脂を半硬化させる方法であって、上記離型フィルム３は、塗布した樹脂組成物２の樹脂たれを抑止できる範囲からなる孔径を有する貫通孔４を複数設けてなる。 - 特許庁

This method for producing a prepreg comprises introducing a substrate 1 into an impregnation tank 10 stored with the resin composition 2 diluted with the solvent, passing the substrate 1 impregnated with the resin composition 2 between a pair of squeeze rolls 3 and 3 oppositely arranged approximately horizontally and heating the substrate by a dryer 5 to semicure a resin of the resin composition 2.例文帳に追加

溶剤で希釈した樹脂組成物２が貯えられた含浸槽１０に基材１を導入し、この樹脂組成物２を含浸した基材１を、略水平に対向させて配置された一対のスクイズロール３，３の間に通した後、乾燥機５で加熱して樹脂組成物２の樹脂を半硬化させる製造方法。 - 特許庁

In applying a resin compsn. 1 containing a thermosetting resin to a continuously moving release film 2 to semicure the formed resin coating layer, a plurality of high frequency anodes 3 and a plurality of high frequency cathodes 4 irradiating the coated resin compsn. 1 with electromagnetic waves are provided above and below the release film so as to be arranged in the moving direction of the release film in a lattice form.例文帳に追加

連続的に移動する離型フィルム２上に、熱硬化性樹脂を含む樹脂組成物１を塗布し、樹脂を半硬化させるものであって、上記塗布した樹脂組成物１に電磁波を照射する高周波電極３，４の陽極と陰極を、上記離型フィルムを挟んで上下に設けると共に、上記上及び下に設けた高周波電極３，４は離型フィルムの移動方向にそれぞれ複数備え、且つ、互いに離型フィルム２の移動方向に対し格子状に配置してなる。 - 特許庁