下縁板の英語

基板支持部が基板２の下面の外周縁部分を支持する。例文帳に追加

Each substrate support part supports an outer peripheral part on the undersurface of a substrate 2. - 特許庁

半導体基板の下地層１の上に下地絶縁膜２を形成する。例文帳に追加

In the wiring structure, an underlaying insulation film 2 is formed on an underlaying layer 1 of a semiconductor substrate. - 特許庁

基板上に下から第１の下地絶縁膜、第２の下地絶縁膜、半導体層及びゲート絶縁膜を形成する。例文帳に追加

A first base insulating film, a second base insulating film, a semiconductor layer, and a gate insulating film are formed in this order from below over a substrate. - 特許庁

上記の前側板(12)の上・下端縁(16・20)を、後側板(13)の上・下端縁(19・22)に、それぞれ連結板(17・21)を介して連結固定する。例文帳に追加

The upper and lower end edges (16 and 20) of the front panel (12) are connected and fix to the upper and lower end edges (19 and 22) of the rear panel (13) via connecting panels (17 and 21). - 特許庁

下層基板に、第１の絶縁膜を形成し、第１の絶縁膜上に、第１の絶縁膜より比誘電率の高い第２の絶縁膜を形成する。例文帳に追加

On a sublayer substrate, a first insulating film is formed, on which a second insulating film is formed that has a higher dielectric constant than the first one. - 特許庁

カウンター天板２の前縁に垂下縁部２１を形成し、化粧カバー３の上縁に断面Ｌ字型の係合縁部３１を形成する。例文帳に追加

A droop edge part 21 is formed at the front edge of a counter top plate 2, and an engage edge part 31 having L-shaped cross section is formed at the upper edge of a dressing cover 3. - 特許庁

炎口板３１の両側縁部に下方に屈曲する垂下板部３１ｄを形成する。例文帳に追加

Suspended plate portions 31d bent downward are formed both side edges of the burner port plate 31. - 特許庁

上段側の金属板１の下端縁を下段側の金属板１のマーク６に合わせる。例文帳に追加

The lower edge of the metal plate 1 on the upper stage side is adjusted to the mark 6 of the metal plate 1 on the lower stage side. - 特許庁