紙基材エポキシ樹脂の英語

無機繊維および／または合成繊維を主成分とする不織布基材が、末端にエポキシ基を有するポリエチレングリコールで乳化したビスフェノールＡ型エポキシ樹脂エマルジョンと、硬化剤とからなる水不溶性親水性樹脂により含浸加工されている加湿器エレメント用紙。例文帳に追加

In paper for a humidifier element, a nonwoven fabric base material containing inorganic fibers and/or synthetic fibers as main components is impregnated/processed with/by a water-insoluble, hydrophilic resin comprising a bisphenol A type epoxy resin emulsion emulsified by a polyethylene glycol having terminal epoxy groups and a curing agent. - 特許庁

紙基材に、少なくとも３級アミノ基含有アクリル樹脂からなる主剤とエポキシ基含有シリコン化合物からなる硬化剤とを混合せしめた湿気硬化型シリコン・アクリル樹脂を含浸して硬化させた切断刃２を、ロールカートン１に接着した。例文帳に追加

The cutting blade 2, which is formed by hardening a paper substrate impregnated with a wet hardening silicon acrylic resin formed by mixing a main agent of at least a third-class amino group contained acrylic resin and a hardening agent of an epoxy group contained silicon compound, is adhered to the roll carton 1. - 特許庁

嵩密度が０．５〜０．８、引張り張力が９．８Ｎ／１０ｍｍ巾以上で厚みが１００μｍ以下である紙基材に、エポキシ樹脂を主成分としたワニスを含浸し加熱乾燥してなる印刷配線板用プリプレグを用いて積層板とする。例文帳に追加

Paper substrates, which are 0.5-0.8 in bulk density, 9.8 N or more per width of 10 mm in tensile strength, and 100 μm or less in thickness, are impregnated with a varnish composed mainly of an epoxy resin and then dried by heating for the fabrication of prepregs to be built into laminates for printed wiring boards. - 特許庁

嵩密度が０．５〜０．８、引張り張力が９．８Ｎ／１０ｍｍ巾以上で厚みが１００μｍ以下である紙基材に、エポキシ樹脂を主成分とした無溶剤ワニスを含浸し加熱乾燥してなる印刷配線板用プリプレグを用いて積層板とする。例文帳に追加

Paper substrates, which are 0.5-0.8 in bulk density, 9.8 N or more per width of 10 mm in tensile strength, and 100 μm or less in thickness, are impregnated with a solventless varnish composed mainly of an epoxy resin and then dried by heating for the fabrication of prepregs to be built into laminates for printed wiring boards. - 特許庁