か洞裏装の英語

高周波モジュール用基板の裏面が、導電性接着材を介してシャーシに接着接合されてなる高周波モジュールの実装構造において、基板の裏面に反りがある場合においても、基板の裏面とシャーシとの接合部に空洞部分が形成されて伝送ロスが発生しない高周波モジュールの実装方法及び実装構造を実現することを課題とする。例文帳に追加

To realize a method and a structure for packaging a high frequency module by bonding the rear surface of a substrate for high frequency module to a chassis through conductive adhesive in which a cavity part is formed at the joint of the rear surface of the substrate and the chassis to prevent generation of transmission loss. - 特許庁

接合部に空洞状、溝状、畝状等の欠陥を生じることなく、同一プローブで板厚の異なる被接合部材の接合が可能、湾曲状材料、中空形材等を裏当てなしで接合可能、肉厚板材やハニカムパネルを一つの摩擦攪拌接合装置で高能率の接合が可能となる貫通摩擦攪拌接合用プローブの提供を課題とする。例文帳に追加

To provide a penetrating frictional agitation joining probe capable of joining a member to be joined having different plate thickness with the same probe, joining curved materials and hollow shapes or the like without a backing and high efficiently joining thick plate stocks and honeycomb panels with one frictional agitation joining device, without generating defects such as a void shape, a groove shape and a ridge shape in a joined part. - 特許庁