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紙基材フェノール樹脂銅張積層板例文帳に追加

PAPER BASE PHENOLIC RESIN COPPER-CLAD LAMINATE - 特許庁

固形分の窒素含有率が１０〜５０重量％である下塗り用フェノール樹脂組成物を用いて含浸乾燥処理した紙基材に、フェノール樹脂ワニスを含浸乾燥処理して得られたプリプレグと銅はくとを積層成形してなる紙基材フェノール樹脂銅張積層板。例文帳に追加

This laminate is formed by a method wherein a paper base subjected to impregnation and drying by using a phenolic resin composition for priming of which the nitrogen content of the solid matter is 10-50 wt.% is impregnated with the phenolic resin varnish and dried and a prepreg thus obtained and a copper leaf are laminate-molded. - 特許庁

紙基材に前記のフェノール樹脂組成物を含浸，乾燥させて得られたプリプレグを重ね合わせ，最外層に銅箔を重ねて積層し得られるフェノール樹脂銅張積層板。例文帳に追加

The copper-clad phenolic resin laminated board is obtained by impregnating a paper base with this phenolic resin composition followed by drying to obtain a prepreg, then mutually superimposing such prepregs and superimposing and laminating a copper foil on the outermost layer of the resultant prepreg. - 特許庁

ハロゲン系難燃剤を含まない紙基材フェノール樹脂銅張積層板において，紙基材に予めアミノ基を所有するアルコキシシラン誘導体および／またはその縮合物により含浸処理した基材を用い，フェノール樹脂を含浸，加熱乾燥することにより得られたプリプレグを所定枚数重ね合わせ加熱加圧してなるフェノール樹脂積層板を用いる。例文帳に追加

This copper-clad phenol resin-laminated board using a paper substrate containing no halogen-based flame retardant is obtained by using the paper substrate treated by impregnating the substrate with an alkoxysilane derivative having an amino group and/or its condensed substance in advance, impregnating with the phenolic resin, heating and drying to obtain a prepreg, overlapping the prepregs of a prescribed number, and heating and pressing them. - 特許庁

下塗りワニスとしての水溶性フェノール樹脂や水溶性メラミン樹脂の問題点を解決し、民生電子機器のプリント配線板として好適に用いられる難燃性、耐トラッキング性、耐熱性に優れる紙基材フェノール樹脂銅張積層板を提供する。例文帳に追加

To provide a paper base phenolic resin copper-clad laminate which solves the problem of a water-soluble phenolic resin and a water-soluble melamine resin as a prime-coating varnish and which is used suitably as a printed wiring board of consumer electronics and is excellent in fire retardance, tracking resistance and heat resistance. - 特許庁