線膨脹率の英語

低収縮性、低線膨脹率性を有すると共に、耐加水分解性に優れ、特にモータ、コイル等の電気・電子部品の封止用途に好適に用いることができる不飽和ポリエステル樹脂組成物を提供する。例文帳に追加

To provide an unsaturated polyester resin composition which has low shrinkage and a low coefficient of linear expansion, is excellent in resistance to hydrolysis, and in particular can be suitably used in applications for sealing electrical/electronic components such as motors and coils. - 特許庁

熱膨脹率が異なり微小な配線パターンが形成された電子部品あるいは回路基板同士を一括で接続でき接続部の電気抵抗が小さくかつ接続部における不良の生じにくい接続用材料を提供する。例文帳に追加

To provide a connecting material that can batch-connect electronic parts or circuit boards different in the coefficient of thermal expansion and formed with micro wiring patterns, making the electric resistance of a connection part low and hardly causing failure at the connection part. - 特許庁

十分に高弾性率、低線膨張係数、低吸水率、低吸湿膨張係数、低線膨脹係数、高寸法安定性である十分に優れた特性を有するポリイミドフィルム、および該ポリイミドフィルムを用いた各種電気・電子機器用基板を提供すること。例文帳に追加

To provide a polyimide film having sufficiently excellent characteristics such as a sufficiently high elastic modulus, low coefficient of linear expansion, low water absorption, low coefficient of moisture-absorption expansion, low coefficient of linear expansion and a high dimensional stability, and to provide a substrate for various electric and electronic apparatus using the polyimide film. - 特許庁

引張り弾性率が７００ｋｇ／ｍｍ^2以下で、吸湿膨脹係数が２０ｐｐｍ以下であり、特定の繰り返し単位を必須の繰り返し単位として含むポリイミドフィルムを合成し、該ポリイミドフィルムを用いてフレキシブルプリント配線板用積層体をはじめとして各種電気・電子機器用基板を作成する。例文帳に追加

The polyimide film having a tensile elastic modulus of 700 kg/mm^2 or less and a coefficient of moisture-absorption expansion of 20 ppm or less and containing a specific repeating unit as an essential repeating unit is synthesized, and then a substrate for various electric and electronic apparatus such as a laminate for flexible print wiring boards are produced using the polyimide film. - 特許庁