転磨機の英語

被研磨物を回転又は摺動させて研磨する機構を有する上下一対の研磨機構間に被研磨物を挿入して研磨する両面研磨方法であって、上部の研磨機構が下部の研磨機構より被処理物に対する吸着力が弱いことを特徴とする両面研磨方法を提供する。例文帳に追加

The polishing method of double side processing type is provided so as to polish the workpiece inserted between an upper and lower polishing mechanisms each having a mechanism to polish the workpiece in rotation or sliding, wherein the suction attachment force to the workpiece of the upper polishing mechanism is smaller than that of the lower polishing mechanism. - 特許庁

被研磨物を回転又は摺動させて研磨する機構を有する上下一対の研磨機構間に被研磨物を挿入して研磨する両面研磨方法であって、上部の研磨機構が下部の研磨機構より被処理物に対する吸着力が弱いことを特徴とする両面研磨方法を提供する。例文帳に追加

This double-sided polishing method to polish the polished object by inserting it between a pair of upper and lower polishing mechanisms having a mechanism to polish the polished object by rotating or sliding it constitutes its characteristic feature that the upper part polishing mechanism is weaker in sucking force of a treated object than the lower part polishing mechanism. - 特許庁

被研磨物を回転させる回転機構と、前記回転機構により回転する金型２とスポット的に接触することにより当該金型２を研磨する研磨体６を有する研磨工具７と、を備えた研磨装置１である。例文帳に追加

This polishing device 1 has: a rotary mechanism for rotating a polishing object; and a polishing tool 7 having a polishing body 6 for polishing a metal mold 2 by spottedly contacting with the metal mold 2 rotating by the rotary mechanism. - 特許庁

ウェーハ研磨装置におけるウェーハ回転安定化機構例文帳に追加

WAFER ROTATION STABILIZATION MECHANISM IN WAFER POLISHING DEVICE - 特許庁

自動循環式回転バレル研磨機例文帳に追加

AUTOMATIC CIRCULATION TYPE ROTARY BARREL POLISHING MACHINE - 特許庁

加圧プレート用反転機構を備えた平面研磨装置例文帳に追加

PLANE SURFACE POLISHING DEVICE FURNISHED WITH REVERSING MECHANISM FOR PRESSURE PLATE - 特許庁

研磨休止時に待機運転を行い、待機運転終了後に、研磨面に研磨液を供給しながら該研磨面をドレッシングする研磨準備処理を行い、研磨準備処理終了後に被研磨物に対する研磨処理を開始する。例文帳に追加

A standby operation is performed in polishing stoppage, a polishing preparation processing for dressing the polishing surface is performed while supplying polishing liquid after the standby operation is finished, and polishing processing relative to an object to be polished is started after the polishing operation processing is finished. - 特許庁

前記化学的機械的研磨液を、研磨定盤上に貼付した研磨パッドに供給する工程、及び、前記研磨定盤を回転させることで、前記研磨パッドを被研磨体の被研磨面と接触させつつ相対運動させて研磨する工程を含むことを特徴とする研磨方法。例文帳に追加

The polishing method includes: a process of supplying the chemical mechanical polishing liquid to a polishing pad stuck on a polishing surface plate; and a process of polishing by relatively moving the polishing pad and a surface to be polished of a polished body while bringing them into contact with each other by rotating the polishing surface plate. - 特許庁