bondersとは 意味・読み方・使い方

BALL-FORMING APPARATUS FOR WIRE BONDERS例文帳に追加

ワイヤボンダ用ボール形成装置 - 特許庁

To provide an injection molded circuit component manufacturing method which, even when injection molded articles differ in size, does not require rebuilding die bonders and jigs on the wire bonder side and suppresses reduction in die bond accuracy and wire bond accuracy, and to provide a holding member used therein.例文帳に追加

射出成形品の大きさが異なる場合でも、ダイボンダやワイヤボンダ側の治具を作りかえる必要が無く、またダイボンドやワイヤボンドの精度が低下するのを抑制した射出成形回路部品の製造方法及びそれに用いる保持部材を提供する。 - 特許庁

On the top surface of the portion of the lower-side substrate 11, which is present on the side of an end of the lower-side substrate 11, there are formed two bonders 16 extending continuously from two lower electrodes 13 present on both the sides of an end of the lower electrode array 13 formed on the top surface of the lower-side substrate 11.例文帳に追加

そして、下部電極１３とボンディング部１６とを、銅層１３ａ，１６ａの上に、ニッケル層１３ｂ，１６ｂおよび金層１３ｃ，１６ｃを積層して構成し、金層１３ｃ，１６ｃにおける下部電極１３とボンディング部１６との間の部分に隙間１７を設けた。 - 特許庁