nonelectrolytic solutionとは 意味・読み方・使い方

To obtain a resin composition which is excellent in flexibility and resistances to soldering heat, heat degradation, and nonelectrolytic gold plating, can be developed with an organic solvent or a dilute alkali solution, and is suitable for a solder resist and an interlayer insulation layer.例文帳に追加

可撓性、半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤、希アルカリ溶液で現像ができ、ソルダーレジスト用、層間絶縁層用に適する樹脂組成物の提供。 - 特許庁

To obtain a resin composition which gives a cured item excellent in flexibility and resistances to soldering heat, heat degradation, and nonelectrolytic gold plating, can be developed with an organic solvent or a dilute alkali solution, and is suitable for a solder resist and an interlayer insulation layer.例文帳に追加

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用、層間絶縁層用に適する樹脂組成物を提供する。 - 特許庁

To provide a material for electroless plating that is a material for plating used for the manufacturing, or the like of a printed-wiring board ideally and has excellent adhesiveness with a nonelectrolytic plating film formed on a surface even if surface roughness on the surface of the material is small, and to provide a solution and the printed-wiring board using the solution.例文帳に追加

プリント配線板の製造等に好適に用いることができるめっき用材料であり、該材料表面の表面粗度が小さい場合にも、該表面に形成した無電解めっき皮膜との接着性に優れた無電解めっき用材料と溶液、それを用いてなるプリント配線板を提供する。 - 特許庁

To obtain a resin composition suitable for a colder-resist and an insulation layer between layers in a flexible printed circuit board, which is excellent in flexibility of a curing material and resistances to soldering heat, thermal deterioration, and nonelectrolytic gold plating, and can be developed in an organic solvent or a diluted alkaline solution.例文帳に追加

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、フレキシブルプリント配線板のソルダーレジスト用及び層感絶縁層用に適する樹脂組成物を提供する。 - 特許庁

The surface of a material to be polished is chemically and mechanically flattened by using a polishing solution obtained by dispersing complex particles composed of an inorganic substance and a nonelectrolytic organic substance having ≥500 molecular weight as abrasive grains into a solvent and adding a polishing promoter to the dispersion.例文帳に追加

無機物と分子量が５００以上である非電解質の有機物とからなる複合粒子を研磨砥粒として溶媒に分散し、さらに研磨促進剤を添加して研磨液としたものを用いることにより被研磨体表面を化学機械的に予担化する。 - 特許庁