「chesses」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

The resin sealing apparatus is adapted to convey a substrate 90 supplied from a substrate feeder, into a space between upper and lower die chesses 30, 50 by a substrate conveying device 100, to hold the front and rear faces of the substrate 90 by the upper and lower die chesses 30, 50 and to carry out resin sealing of electronic components mounted on the substrate 90 within cavities 41, 61 provided in the die chesses 30, 50.例文帳に追加

基板供給装置から供給された基板９０を基板搬送装置１００で上，下金型チェス３０，５０の間に搬送し、前記基板９０の表裏面を上，下金型チェス３０，５０で挟持するとともに、前記基板９０に実装した電子部品を前記金型チェス３０，５０に設けたキャビティ４１，６１内で樹脂封止する樹脂封止装置である。 - 特許庁

Next, the upper and lower mold chesses are opened, and the substrate 90 is shifted at a predetermined interval; and the substrate 90 is held by the upper and lower mold chesses again, and at least the second electronic component differing from the electronic component is sealed by the resin material filled inside the upper and lower mold cavities 41 and 61.例文帳に追加

ついで、上，下金型チェスを開いて基板９０を所定の間隔だけずらし、再度、上，下金型チェスで基板９０を挟持し、電子部品と異なる少なくとも２番目の電子部品を上型，下型キャビティ４１，６１内に充填した樹脂材料で樹脂封止する。 - 特許庁

Among electronic components of a substrate 90, at least an electronic component that is located at the forefront is sealed by a resin material filled in upper and lower mold cavities 41 and 61 of upper and lower mold chesses.例文帳に追加

基板９０の電子部品のうち、少なくとも先頭に位置する電子部品を上，下金型チェスの上型，下型キャビティ４１，６１内に充填した樹脂材料で封止する。 - 特許庁

Particularly, the front and rear faces of the substrate 90 are held by the upper and lower die chesses 30, 50 to carry out resin sealing in a state of supporting both side edges of the substrate 90 by the substrate conveying device 100 of frame body structure.例文帳に追加

特に、前記基板９０の両側縁部を枠体構造の基板搬送装置１００で支持したままの状態で、前記基板９０の表裏面を上，下金型チェス３０，５０で挟持し、樹脂封止する。 - 特許庁