humidity coefficientとは 意味・読み方・使い方

To provide a resin cured product, a transparent composite substrate, and a display element substrate having a low coefficient of humidity expansion and a low coefficient of water absorption and excellent in transparency and heat resistance.例文帳に追加

湿度膨張率および吸水率が小さく、かつ透明性および耐熱性に優れた樹脂硬化物、透明複合基板および表示素子基板を提供すること。 - 特許庁

The coefficient of friction is changed according to the protrusion of the abrasive grains, the humidity of the grinding atmosphere, or the presence/absence of scattering of a grinding agent.例文帳に追加

摩擦係数は，砥粒の突き出し量，研磨雰囲気の湿度または研磨剤散布の有無によって変化させる。 - 特許庁

Furthermore, the coefficient of the water vapor permeability of the packaging material is ≤2 g/m^2 24h at a relative humidity of 55%RH.例文帳に追加

また包装材は、透湿度係数が２３℃相対湿度５５％ＲＨにおいて２ｇ／ｍ^2・２４ｈ以下である。 - 特許庁

To provide a support for a magnetic recording medium provided with excellent stability in size by reducing a humidity expansion coefficient of a width direction.例文帳に追加

幅方向の湿度膨張係数が小さく、優れた寸法安定性を具備する磁気記録媒体用支持体の提供。 - 特許庁

To provide a polarizing plate having characteristics such as low photoelastic coefficient, high transparency, high humidity resistance and good size stability to temperature and humidity, and to provide a manufacturing method of the polarizing plate.例文帳に追加

低光弾性係数、高透明度、高耐湿性および温度や湿度に対する良好なサイズの安定性などといった特性を備える偏光板およびその製造方法を提供する。 - 特許庁

The coefficient of kinetic friction μd to a surface to be released is preferably at most 0.30 under the condition of 23°C and a relative humidity of 60%.例文帳に追加

被離型面との動摩擦係数μｄが２３℃、相対湿度６０％の条件で、０．３０以下であることが好ましい。 - 特許庁

As a result, a temperature expansion coefficient and a humidity expansion coefficient in the tape width direction of the magnetic layer are made to be 0×10^-6 to 8×10^-6/°C and 0×10^-6 to 10×10^-6/%RH, respectively.例文帳に追加

この結果磁性層のテープ幅方向の温度膨張係数が０×１０^−６〜８×１０^−６／℃、湿度膨張係数は０×１０^−６〜１０×１０^−６／％ＲＨとなる。 - 特許庁

The laminated body has a polyimide type resin layer on copper foil in which a low humidity expansive polyimide type resin layer with a linear humidity expansion coefficient not more than 20×10^-6/% RH and a linear thermal expansion coefficient not more than 25×10^-6/°C is contained in at least one layer of the polyimide type resin layer.例文帳に追加

銅箔上にポリイミド系樹脂層を有する積層体であって、ポリイミド系樹脂層の少なくとも１層に、線湿度膨張係数が２０×１０^-6／％ＲＨ以下で、線熱膨張係数が２５×１０^-6／℃以下のある低湿度膨張性ポリイミド系樹脂層を有する積層体。 - 特許庁