「ウェハ融着」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

その後、貼り合せ用ウェハＳの熱可塑性接着剤Ａを加熱し溶融して、貼り合せ用ウェハＳとウェハＷとの間に熱可塑性接着剤Ａを流し込む。例文帳に追加

Thereafter, the thermosetting adhesive A of the laminating wafer S is heated and melted, and the thermosetting adhesive A is run between the laminating wafer S and the wafer W. - 特許庁

このペレットをウェハとそれを固定するための基体の間で加熱して融解させそして両者を密着させて固定化する。例文帳に追加

The pellets interposed between the semiconductor wafer and the base where the wafer is fixed are heated to be melted, and the wafer and the base are brought into close contact with each other and fixed with each other. - 特許庁

半導体ウェハ１２０を接着剤１２４で支持体１２２に貼り付けて支持する半導体ウェハの支持方法において，前記接着剤１２４の融解温度は，４０〜９５℃の温度範囲にあり，かつ前記支持体１２２の熱伝導率は，１００〜３００Ｗ／ｍＫの範囲にある，ことを特徴とする半導体ウェハの加工方法が提供される。例文帳に追加

In the method of supporting the semiconductor wafer for supporting a semiconductor wafer 120 while sticking it on a support 122 with an adhesive agent 124, a working method for the semiconductor wafer is provided with features that a melting temperature of the adhesive agent 124 is within a temperature range of 40-95°C and a heat conductivity of the support 122 is within a range of 100-300 W/mK. - 特許庁

ウェハー上のパッドとの接続に関して十分な寸法精度を有し、なおかつ、焼成時に焼成セッターとの融着を防止できる多層セラミック基板及びその製造方法を提供すること。例文帳に追加

To provide a multilayer ceramic substrate and a method for manufacturing the substrate which has sufficient dimensional accuracy, regarding a pad on a wafer, and which also can prevent fusion with a burning setter at burning. - 特許庁

接着剤の融解を防止して被処理体を常温加工することが可能な新規かつ改良された半導体ウェハの支持方法を提供する。例文帳に追加

To provide a novel and improved method of supporting a semiconductor wafer with which an object to be treated is worked at an ordinary temperature by preventing an adhesive agent from being molten. - 特許庁