平面研磨盤の英語

平面研磨装置の下定盤駆動機構例文帳に追加

LOWER SURFACE PLATE DRIVING MECHANISM OF SURFACE GRINDER - 特許庁

平面研磨装置の上定盤旋回機構例文帳に追加

UPPER SURFACE PLATE TURNING MECHANISM OF SURFACE GRINDER - 特許庁

定盤の製造方法及び平面研磨装置例文帳に追加

MANUFACTURING METHOD OF SURFACE TABLE AND SURFACE POLISHING APPARATUS - 特許庁

平面研削・研磨装置の定盤の平坦度及び形状測定装置例文帳に追加

FLATNESS AND SHAPE MEASURING DEVICE FOR SURFACE PLATE FOR SURFACE GRINDING/POLISHING DEVICE - 特許庁

本発明は、柔軟な研磨フィルムを用いた仕上研磨用定盤において、潤滑材の膜が除去され易く、研磨試料の研磨面が研磨フィルムに吸い付きにくく、削り屑が研磨面を傷つけることがなく、また、耐摩耗性が大きく異なる素材からなる複合材料を研磨する場合でも、平面性の高い研磨が可能な仕上研磨用定盤を提供することを目的とする。例文帳に追加

To provide a surface plate for finish polishing using a flexible polishing film in which the film of a lubricant is easily removed, the polishing surface of a polishing specimen does not have a tendency to be sucked to the polishing film, chips do not damage the polishing surface, and a highly flat polishing is performed even when a composite material formed of materials with largely different wear resistances is polished. - 特許庁

精密平行平面研磨盤における定盤修正方法及び修正装置例文帳に追加

SURFACE PLATE CORRECTING METHOD AND SURFACE PLATE CORRECTING DEVICE FOR PRECISE PARALLEL SURFACE GRINDER - 特許庁

研磨中（定盤回転中）にウエハの厚みおよび研磨クロスの厚みを測定し、定盤を途中で停止させることなくウエハの仕上げ厚みや平坦度を正確に作りこむことができる平面研磨装置を提供する。例文帳に追加

To provide a surface polishing device capable of precisely making finishing thickness and flatness of a wafer without stopping a surface plate in the middle by measuring thickness of the wafer and thickness of polishing cloth in the middle of polishing (while the surface plate is rotated). - 特許庁

竪型両頭平面研削盤及びその治具取付基準面のセルフ研磨方法例文帳に追加

VERTICAL DUPLEX SURFACE GRINDER AND METHOD OF SELF-GRINDING TOOL MOUNTING REFERENCE SURFACE THEREOF - 特許庁