片面めっきの英語

片面めっきプレス材の製造方法、及び、燃料電池セパレータ用バイポーラプレートの製造方法、並びに、該各方法に用いる片面めっき装置例文帳に追加

METHOD FOR MANUFACTURING ONE SIDE PLATING PRESS MATERIAL, AND METHOD FOR MANUFACTURING BIPOLAR PLATE FOR FUEL CELL SEPARATOR, AND SINGLE SIDE PLATING EQUIPMENT USED IN EACH METHOD - 特許庁

絶縁性フィルム基材の少なくとも片面に乾式めっき法または無電解めっき法によりシード層を設けた後、該シード層上にめっき法により、銅めっき層とニッケルめっき層とを交互に少なくとも１回、形成する。例文帳に追加

A shield layer is provided on at least one of surfaces of an insulating film material by dry plating or by electroless plating, and then copper and nickel plating layers are alternately formed on the shield layer at least once by plating. - 特許庁

プラスチックの片面無電解電気メッキ方法とそれにより製造される構造例文帳に追加

ONE SIDE ELECTROLESS ELECTROPLATING METHOD OF PLASTIC AND STRUCTURE PRODUCED BY THE SAME - 特許庁

本発明は、無電解めっき法、特に片面めっき法においてめっき層、被めっき層の密着強度に関与する触媒金属の捕捉を目的とする。例文帳に追加

To catch the catalyst metal participating in the adhesion strength of a plating layer and layer to be plated in an electroless plating method, more particularly a one-side plating method. - 特許庁

銅箔１（主導体層）の片面全面にニッケルめっき３を施すとともにその反対面にパターン付きのスズめっき２を施し、ニッケルめっき３の表面に銅めっき５（基層導体層）を形成する。例文帳に追加

Nickel plating 3 is applied to the whole face of one side of a copper foil 1 (main conductor layer), tin plating 2 with a pattern is applied to its opposite side, and copper plating 5 (substratum conductor layer) is made on the surface of the nickel plating 3. - 特許庁

銅箔１（主導体層）の片面全面にニッケルめっき３を施すとともにその反対面にパターン付きのニッケルめっき２を施し、ニッケルめっき３の表面に銅めっき５（基層導体層）を形成する。例文帳に追加

Nickel plating 3 is applied to the whole face of one side of a copper foil 1 (main conductor layer), tin plating 2 with a pattern is applied to its opposite side, and copper plating 5 (substratum conductor layer) is made on the surface of the nickel plating 3. - 特許庁

銅箔１（主導体層）の片面全面にニッケルめっき３を施すとともにその反対面にパターン付きのニッケルめっき２を施し，ニッケルめっき３の表面に銅めっき５（基層導体層）を形成する。例文帳に追加

A copper foil 1 (main conductor layer) has a nickel plating layer 3 on the whole surface of one side and a patterned nickel plating layer 2 on the surface of the opposite side, and has a copper plating layer 5 (base layer conductor layer) on the surface of the nickel plating layer 3. - 特許庁

銅箔１（主導体層）の片面全面にニッケルめっき３を施すとともにその反対面にパターン付きのスズめっき２を施し，ニッケルめっき３の表面に銅めっき５（基層導体層）を形成する。例文帳に追加

A copper foil 1 (main conductor layer) has a nickel plating layer 3 on the whole surface of one side and a thicker patterned tin plating layer 2 on the surface of the opposite side, and has a copper plating layer 5 (base layer conductor layer) on the surface of the nickel plating layer 3. - 特許庁