光周処理の英語

第１のロックイン処理部１７は、第１の光源部５ａの光源素子の変調周波数を参照周波数としてロックイン処理を行う。例文帳に追加

A first lock-in processing part 17 locks in the modulation frequency of a light source element of the first light source part 5a as a reference frequency. - 特許庁

第２のロックイン処理部１８は、第２の光源部５ｂの光源素子の変調周波数を参照周波数としてロックイン処理を行う。例文帳に追加

A second lock-in processing part 18 locks in the modulation frequency of a light source element of the second light source part 5b as a reference frequency. - 特許庁

処理液の交換等において感光材料を処理する場所やその周囲に処理液がこぼれたり飛散することがなく、処理液の寿命を延長可能な感光材料処理カートリッジ、及び感光材料処理装置を得ること。例文帳に追加

To provide a cartridge for processing photosensitive materials which prevents a processing solution from spilling and scattering in a place for processing the photosensitive materials or the peripheries thereof in exchanging the processing solution or the like and can prolong the life of the processing solution, and to obtain an apparatus for processing the photosensitive materials. - 特許庁

膜厚の測定は，ウェハＷの周辺露光処理の前後に行う。例文帳に追加

The measurement of the film thickness is performed before and after the perimeter exposure processing of the wafer W. - 特許庁

感光材料を処理する場所やその周囲に処理液がこぼれたり飛散することがない感光材料処理カートリッジ、及び感光材料処理装置を得る。例文帳に追加

To obtain a photosensitive material processing cartridge and a photosensitive material processor which eliminate the falling and scattering of processing liquid to the place where a photosensitive material is processed and its periphery. - 特許庁

感光材料を処理する場所やその周囲に処理液がこぼれたり飛散することがない感光材料処理カートリッジ及び感光材料処理装置を得る。例文帳に追加

To obtain a photosensitive material processing cartridge and a photosensitive material processor which prevent the processing liquid from being spilled or scattered on or around the place where the photosensitive materials are processed. - 特許庁

感光材料を処理する場所やその周囲に処理液がこぼれたり飛散することがない感光材料処理カートリッジ及び感光材料処理装置を得ること。例文帳に追加

To obtain a photosensitive material processing cartridge and a photosensitive material processor, which can prevent a processing liquid from spilling and splashing to a place where photosensitive materials are processed and its surroundings. - 特許庁

被処理体Ｗが収容された筒状の処理室１２内に処理ガスを供給してプラズマを生成し、生成したプラズマにて被処理体Ｗにプラズマ処理を施すプラズマ処理装置に、前記処理室１２内の略中央部に光を照射する第１光照射手段と、前記処理室１２内の周壁側の領域に光を照射する第２光照射手段とを備える。例文帳に追加

The plasma processing apparatus that supplies a processing gas into a cylindrical processing chamber 12 accommodating the workpiece W to generate plasma and performs the plasma processing on the workpiece W with the generated plasma includes a first light irradiator of irradiating a nearly center portion in the processing chamber 12 with light and a second light irradiator of irradiating a region in the processing chamber 12 on the side of a peripheral wall with light. - 特許庁