insoluble substrateとは 意味・読み方・使い方

To provide electrolytic plating equipment with an insoluble anode, which can easily remove a substrate and prevent irregular deposition or inclusions caused by oxygen which is generated at the insoluble anode and trapped on the substrate.例文帳に追加

基板の設置、取り出しが容易にでき、不溶性陽極において発生した酸素が基板に溜まることにより生じる析出不良や埋込不良を防止できる、不溶性陽極を用いたメッキ装置を提供する。 - 特許庁

To provide a single-use cosmetic article comprising a water-insoluble substrate impregnated with an aqueous cosmetic composition.例文帳に追加

水性の化粧品用組成物を含浸させた、水に不溶の基体を含む使い捨て化粧用品の提供。 - 特許庁

This insoluble electrode has a metallic phase consisting of Ni and Mo on a metallic substrate formed of valve metal.例文帳に追加

バルブ金属からなる金属基体上に、Ｎｉ及びＭｏからなる金属相を有する不溶性電極。 - 特許庁

In the anode 32 for electroplating which faces the coating surface of the substrate W and is arranged in a plating solution Q, a first insoluble anode 36 comprising a first insoluble material and a second insoluble anode 38 comprising a second insoluble material having an oxygen generation overvoltage different from that of the first insoluble material are electrically conducted to each other and arranged in a planar state.例文帳に追加

基板Ｗの被めっき面に対向してめっき液Ｑ中に配置される電気めっき用アノード３２であって、第１の不溶性材料から構成される第１の不溶性アノード３６と、第１の不溶性材料と酸素発生過電圧が異なる第２の不溶性材料から構成される第２の不溶性アノード３８とを、互いに導通させて平面状に配置した。 - 特許庁

The subject product comprises a water-insoluble substrate, a liquid impregnate wherein the liquid impregnate is present in a weight ratio to the water-insoluble substrate of greater than about 5%, and a plurality of microcapsules comprising a microcapsule wall surrounding a liquid core.例文帳に追加

本製品は、水不溶性基質と、この水不溶性基質に対し約５％を超える重量割合で存在する液状含浸物と、液状コアを囲むマイクロカプセル壁を有する複数のマイクロカプセルとを含んでなる。 - 特許庁

The ink receptive substrate comprises a base layer formed from a water-insoluble thermoplastic polymer, and an ink receptive layer disposed on the base layer.例文帳に追加

インク受容基材は水不溶性ポリマーから形成される基層と基層上に配置されたインク受容層とを含む。 - 特許庁

The abrasive pad for the semiconductor substrate has an abrasive surface 3 for grinding the objective surface of a semiconductor substrate, and is provided with water insoluble resin 2 having a grinding surfaces 3 formed rough for grinding the surface of the semiconductor substrate, and inorganic fine grains 5 adsorbed on the grinding surfaces 3 of the water insoluble resin 2.例文帳に追加

半導体基板の研磨用パッドは、半導体基板の被研磨面を研磨するための研磨面３であって、凹凸形状に形成された研磨面３を有する非水溶性樹脂２と、非水溶性樹脂２の研磨面３に沿って吸着された無機物微粒子５とを備える。 - 特許庁

To provide a substrate processing equipment and a substrate processing method which allows removal of impurities including micells, insoluble matters, or the like attached to a substrate, and also to provide a nozzle for the rinse treatment used for these.例文帳に追加

基板に付着したミセルや不溶解物等の不純物を除去することができる基板処理装置及び基板処理方法、またこれらに用いられるリンス処理用のノズルを提供すること。 - 特許庁