interface bonding characteristicとは 意味・読み方・使い方

To provide an oxide semiconductor device for ensuring stability in device characteristics by suppressing device characteristic deterioration, with the passage of time, caused by diffusion of 1A base elements on a p/n bonding interface or p/i/n bonding interface.例文帳に追加

ｐ／ｎ接合界面又はｐ／ｉ／ｎ接合界面における１Ａ族元素の拡散による素子特性の経時的劣化を抑制し、素子特性の安定性を確保することを目的とした酸化物半導体素子を提供する。 - 特許庁

To provide a gas detection device having excellent bonding stability of an interface between a conversion electrode and a solid electrolyte substrate, and stable sensitivity characteristic and detection performance.例文帳に追加

変換電極と固体電解質基板との界面の接合安定性に優れ、安定した感度特性・検知性能を有するガス検出装置を提供する。 - 特許庁

To provide a Pt base conductive coating material forming an intermetallic compound having a slow growing speed at the bonding or pressing interface of an Sn base solder alloy and markedly excellent in the secular deterioration characteristic resistance at the interface.例文帳に追加

Ｓｎ基ハンダ合金の接合界面又は押圧界面で、成長速度が遅い金属間化合物が生成し、上記界面での耐経年劣化特性が格段に優れた導電性被覆材料を提供する。 - 特許庁

To provide a conductive coating material forming an intermetallic compound having a slow growing speed at the bonding or pressing interface of an Sn-based solder alloy and having markedly excellent characteristic in resistance, to deterioration with time.例文帳に追加

Ｓｎ基ハンダ合金の接合界面又は押圧界面における金属間化合物の成長速度が極端に遅く、耐経年劣化特性が格段に優れた導電性被覆材料を提供する。 - 特許庁

The Ir-based conductive coating material having excellent characteristic in resistance to deterioration with time is characterized in that an interface thin layer containing an Ir-Sn-based intermetallic compound is formed to the bonding or pressing interface where Sn or the Sn-based alloy is bonded or pressed.例文帳に追加

Ｓｎ又はＳｎ基合金が接合又は押圧された接合界面又は押圧界面に、Ｉｒ−Ｓｎ系金属間化合物を含む界面薄層が形成されていることを特徴とする耐経年劣化特性に優れたＩｒ基導電性被覆材料。 - 特許庁

The Pt base conductive coating material containing Pt and excellent in secular deterioration characteristic resistance is characterized in that a thin film containing a Pt-Sn type intermetallic compound (mainly comprising PtSn_4 and Pt_3Sn_17) is formed to the bonding or pressing interface wherein Sn or the Sn base alloy is bonded or pressed.例文帳に追加

Ｓｎ又はＳｎ基合金が接合又は押圧された接合界面又は押圧界面に、Ｐｔ−Ｓｎ系金属間化合物（主として、ＰｔＳｎ_4及びＰｔ_3Ｓｎ_17）を含む薄層が形成されていることを特徴とする耐経年劣化特性に優れたＰｔを含むＰｔ基導電性被覆材料。 - 特許庁