passive component partとは 意味・読み方・使い方

Solder is supplied on a wiring board 2, a semiconductor chip and passive component 4 are mounted, and a connecting terminal 4a of the passive component part 4 is connected to the substrate side terminal 11a of the wiring board 2 via a solder 13a by reflowing.例文帳に追加

配線基板２上に半田を供給し、半導体チップおよび受動部品４を搭載し、リフローにより受動部品４の接続端子４ａを配線基板２の基板側端子１１ａに半田１３ａを介して接続する。 - 特許庁

The electronic component built-in substrate has the passive component built in a resin substrate having a plurality of layers of wiring, wherein the passive component is arranged in an insulating layer at a center part of the plurality of layers of the electronic component built-in substrate, and connected to the wiring layer using the material making electric and mechanical connections by forming an alloy of two or more kinds of metal materials.例文帳に追加

複数層の配線を有する樹脂基板内に受動部品を内蔵してなる電子部品内蔵基板であって、前記受動部品は前記電子部品内蔵基板の前記複数層の中央部の絶縁層内に配置され、前記受動部品は少なくとも２種類以上の金属材料が合金を形成して電気的及び機械的に接続する材料を用いて前記配線層に接続されている電子部品内蔵基板である。 - 特許庁

The component is provided consecutively with an attenuating coupling part where the width of the active waveguide 24 is reduced gradually and where the width of the passive waveguide 22 increases, and a mode expanding part including only the waveguide 22 of which the width is reduced gradually.例文帳に追加

該部品は、能動導波路の幅は漸減し、受動導波路の幅は増加する減衰結合部と、幅が漸減する受動導波路のみを含むモード拡張部とを連続して備える。 - 特許庁

In a multilayer substrate for the semiconductor device in which the electronic component 13 such as a semiconductor element or a passive component is buried in the composite material layer 12 forming one part of the supporting substrate 2, a material of low elastic modulus is used as a die bond material 16 in mounting the electronic component 13 on a core substrate 11.例文帳に追加

半導体素子や受動部品などの電子部品１３が支持基板２の一部を成すコンポジット材料層１２中に埋込まれて成る半導体装置用の多層基板において、電子部品１３をコア基板１１に装着するにあたって、ダイボンド材１６を低弾性率の材料とする。 - 特許庁

In the passive component 15, the element 17 is bonded substantially in parallel with a substrate surface to a high position 28 through an adhesive 33, and a part (lower end portion) of the electrode terminals 16, 16 is located in the space within recesses 27, 27, respectively.例文帳に追加

受動部品１５は、素体部１７が接着剤３３を介して高位部２８に基板面と略平行になるように固着されており、電極端子１６、１６の一部（下端部）は、凹部２７、２７内の空間にそれぞれ位置する。 - 特許庁

In the passive component 15, the element 17 is bonded substantially in parallel with the substrate surface to a high position 28 through adhesive 33, and a part (lower end portion) of the electrode terminals 16 and 16 is located in the space within recesses 27 and 27.例文帳に追加

受動部品１５は、素体部１７が接着剤３３を介して高位部２８に基板面と略平行になるように固着されており、電極端子１６、１６の一部（下端部）は、凹部２７、２７内の空間にそれぞれ位置する。 - 特許庁

To provide a technique and equipment which are capable of carrying out a part mounting process of mixedly mounting semiconductor component that are mounted in a flip chip mounting manner by the use of an adhesive agent and passive parts that are suitably mounted by reflow soldering on a circuit board in a shorter time than usual.例文帳に追加

本発明は、接着剤を用いたフリップチップ実装の半導体部品等と、はんだリフロー実装が適する受動部品等が混載した回路基板の部品実装工程において、従来法より工程時間が短い工法および装置を提供することを目的とする。 - 特許庁