third spacesとは 意味・読み方・使い方

The second boundary wall is provided with a communication port 133 to communicate with the second and the third spaces.例文帳に追加

第１の境界壁１２１によって第１の空間と区画され、第２の境界壁１３１によって第２の空間と区画された、第３の空間とを備えている。 - 特許庁

A battery pack 61 is removably housed in first and second spaces 42, 43 of the housing part 32, and a battery charger 101 is housed in a third space 44.例文帳に追加

収容部３２の第１及び第２空間４２，４３にバッテリパック６１を取り出し自在に収容し、第３空間４４に充電器１０１を収容する。 - 特許庁

Five cylindrical filters 5a-5e for removing chemical substance are arranged in the third space 8, the inside spaces of which are made to communicate with the second space 7.例文帳に追加

第３の空間８には、５基の円筒状の化学物質除去フィルタ5a〜5eがその内部空間を第２の空間７に連通させて配設される。 - 特許庁

Each of the buffer regions 32, 34, and 36 containing the blank spaces 24 is constituted of first and third AlN layers 21 and 23 and a second GaN layer 22.例文帳に追加

空所２４を有するバッファ領域３２、３４、３６をＡｌＮから成る第１及び第３の層２１、２３とＧａＮから成る第２の層２２とで構成する。 - 特許庁

First intermediate discharge ports 51, 56 and second intermediate discharge ports 52, 57 communicating with a second operation closed space 62 and a third operation closed space 63 being operation closed spaces prior to becoming the minimum closed spaces are provided.例文帳に追加

最小密閉空間となる前の作動密閉空間である第２作動密閉空間６２及び第３作動密閉空間６３と連通する第１中間吐出口５１、５６及び第２中間吐出口５２及び５７を設ける。 - 特許庁

The first partition wall 25 and the second partition wall 26 are located on a bottom plate in an opening of the box body 12 and the first to third storage spaces 27-29 are formed with partition walls.例文帳に追加

箱本体１２の開口部内において、底板１５には第１仕切り壁２５及び第２仕切り壁２６が設けられ、第１〜第３収容スペース２７〜２９が仕切り形成されている。 - 特許庁

When the first - the third plate materials are laminated, a first - a third filling spaces P1-P3 are formed between each plate material, and a latent heat storage material, the exhaust heat hot water and the hot water to be supplied are filled in each space to exchange the heat between them.例文帳に追加

従って、第１〜第３の板材１７〜１９を積層すると、各板材の間に第１〜第３の充填空間Ｐ１〜Ｐ３が形成されるので、そこに潜熱蓄熱材、排熱温水、給湯水をそれぞれ充填し、相互に熱交換できるようにする。 - 特許庁

Then, after an insulation film 20 is so deposited by plasma CVD method as to cover the third layer interconnections 11L3, another insulation film 15c is deposited by HDP-CVD method on top of the insulation film 20 to completely fill in spaces between adjacent interconnections of the third layer interconnections 11L3.例文帳に追加

続いて、この第３層配線１１Ｌ３を覆うように、プラズマＣＶＤ法により絶縁膜２０を堆積した後、その上にＨＤＰ−ＣＶＤ法により絶縁膜１５ｃを堆積して第３層配線１１Ｌ３の隣接間を隙間無く埋め込む。 - 特許庁