「laminated circuit board」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

LAMINATED CERAMIC CIRCUIT BOARD例文帳に追加

積層セラミック回路基板 - 特許庁

LAMINATED PLATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR LAMINATED PLATE FOR CIRCUIT BOARD例文帳に追加

回路基板用積層板、回路基板および回路基板用積層板の製造方法 - 特許庁

LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD例文帳に追加

積層板及び多層プリント回路板 - 特許庁

RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, AND LAMINATED BOARD例文帳に追加

回路基板用樹脂組成物、プリプレグおよび積層板 - 特許庁

WIRING BOARD, LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD例文帳に追加

配線基板、積層回路基板およびその製造方法 - 特許庁

PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD例文帳に追加

プリプレグ、積層板及びプリント配線板 - 特許庁

PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD例文帳に追加

プリプレグ、積層板およびプリント配線板 - 特許庁

PREPREG AND LAMINATED BOARD FOR PRINTED CIRCUIT BOARD例文帳に追加

印刷配線板用プリプレグおよび積層板 - 特許庁

RESISTANCE-LAYER LAMINATED BOARD AND CIRCUIT BOARD WITH BUILT-IN RESISTANCE ELEMENT例文帳に追加

抵抗層積層基板及び抵抗素子内蔵回路基板 - 特許庁

LAMINATED CAPACITOR, CIRCUIT BOARD, AND CIRCUIT MODULE例文帳に追加

積層コンデンサ、回路基板及び回路モジュール - 特許庁

CIRCUIT BOARD FOR LAMINATION, AND LAMINATED CIRCUIT例文帳に追加

積層用回路基板および積層回路 - 特許庁

CIRCUIT BOARD AND LAMINATED CIRCUIT BOARD AS WELL AS THEIR MANUFACTURING METHOD例文帳に追加

回路基板及び積層回路基板並びにそれらの製造方法 - 特許庁

LAMINATED BODY AND FLEXIBLE CIRCUIT BOARD USING THE LAMINATED BODY例文帳に追加

積層体及び該積層体を用いたフレキシブル回路基板 - 特許庁

METHOD OF MANUFACTURING LAMINATED SUBSTRATE, LAMINATED SUBSTRATE AND PRINTED CIRCUIT BOARD例文帳に追加

積層基材の製造方法、積層基材およびプリント配線板 - 特許庁

METHOD OF MANUFACTURING MULTILAYER LAMINATED CIRCUIT BOARD例文帳に追加

多層積層回路基板の製造方法 - 特許庁

THERMOSETTING LOW DIELECTRIC RESIN COMPOSITION AND LAMINATED CIRCUIT BOARD例文帳に追加

熱硬化性低誘電樹脂組成物及び回路積層板 - 特許庁

LOW DIELECTRIC RESIN COMPOSITION AND CIRCUIT LAMINATED BOARD例文帳に追加

低誘電樹脂組成物及び回路積層板 - 特許庁

METALLIC FOIL AND LAMINATED SHEET FOR CIRCUIT BOARD SUBSTRATE USING THE FOIL例文帳に追加

金属箔、それを用いた回路基板用の積層板 - 特許庁

METAL CLAD LAMINATED PLATE, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE例文帳に追加

金属張積層板、プリント回路板および半導体装置 - 特許庁

CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND LAMINATED SUBSTRATE例文帳に追加

回路基板及びその製造方法並びに積層基板 - 特許庁

METHOD FOR MANUFACTURING LAMINATED BODY UNIT FOR WIRING CIRCUIT BOARD例文帳に追加

配線回路基板用の積層体ユニットの製造方法 - 特許庁

METHOD OF MANUFACTURING LAMINATED GLASS-CERAMIC CIRCUIT BOARD例文帳に追加

積層ガラス−セラミック回路基板の製造方法 - 特許庁

METHOD OF MANUFACTURING LAMINATED CIRCUIT WIRING BOARD例文帳に追加

積層回路配線基板の製造方法 - 特許庁

LAMINATED DIELECTRIC FILTER AND HIGH FREQUENCY CIRCUIT BOARD例文帳に追加

積層型誘電体フィルタ及び高周波回路基板 - 特許庁

PREPREG, LAMINATED PLATE AND PRINTED CIRCUIT BOARD例文帳に追加

プリプレグ、積層板及びプリント配線板 - 特許庁

MANUFACTURING METHOD OF LAMINATED SHEET FOR ELECTRONIC CIRCUIT BOARD例文帳に追加

電子回路基板用積層板の製造方法 - 特許庁

USAGE OF LAMINATED BODY AND CIRCUIT BOARD例文帳に追加

積層体の使用方法及び回路基板 - 特許庁

LAMINATED BODY, METHOD FOR MANUFACTURING IT, AND MULTI- LAYER CIRCUIT BOARD例文帳に追加

積層体及びその製造方法、並びに多層回路基板 - 特許庁

SHEET WITH METALLIC FOIL AND LAMINATED BODY FOR CIRCUIT BOARD例文帳に追加

金属箔付きシートおよび回路基板用積層体 - 特許庁

THERMOSETTING LOW-PERMITTIVITY RESIN COMPOSITION AND CIRCUIT LAMINATED BOARD例文帳に追加

熱硬化性低誘電樹脂組成物及び回路積層板 - 特許庁

LAMINATED MATERIAL FOR CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF例文帳に追加

回路基板用積層体およびその製造方法 - 特許庁

MANUFACTURING METHOD OF LAMINATED STRUCTURE FOR FLEXIBLE CIRCUIT BOARD例文帳に追加

フレキシブル回路基板用積層構造体の製造方法 - 特許庁

CIRCUIT BOARD FOR MOUNTING LAMINATED CERAMIC CAPACITOR例文帳に追加

積層セラミックコンデンサを実装した回路基板 - 特許庁

PROCESS FILM FOR MANUFACTURING LAMINATED CIRCUIT BOARD例文帳に追加

積層回路基板製造用工程フィルム - 特許庁

LAMINATED BOARD WITH INTERLAYER CIRCUIT AND ITS MANUFACTURE例文帳に追加

内層回路入り積層板及びその製造方法 - 特許庁

Then another three-dimensional circuit board 3 is laminated upon the circuit board 3 and fixed to the board 3 with an ultraviolet-curing resin 7.例文帳に追加

その上層に立体回路基板３を積層し、紫外線硬化樹脂７で固着する。 - 特許庁

METHOD OF MANUFACTURING LAMINATED BODY FOR FORMING MULTILAYER PRINTED CIRCUIT BOARD, LAMINATED BODY FOR FORMING MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD例文帳に追加

多層プリント配線板形成用の積層体の製造方法、多層プリント配線板形成用の積層体、及び多層プリント配線板 - 特許庁

BASE MATERIAL FOR LAMINATED BOARD, AND PREPREG AND LAMINATED BOARD FOR ELECTRIC CIRCUIT USING THE SAME例文帳に追加

積層板用基材並びにそれを用いたプリプレグ及び電気回路用積層板 - 特許庁

EPOXY RESIN COMPOSITION, PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD例文帳に追加

エポキシ樹脂組成物並びにプリプレグ、積層板及びプリント配線板 - 特許庁

PREPREG, METAL-PLATED LAMINATED BOARD AND PRINTED CIRCUIT BOARD USING THEM例文帳に追加

プリプレグ，金属張積層板及びこれらを用いた印刷配線板 - 特許庁

PREPREG, INSULATION LAYER, METAL-CLAD LAMINATED BOARD AND PRINTED CIRCUIT BOARD例文帳に追加

プリプレグ、絶縁層、金属箔張り積層板ならびにプリント配線板 - 特許庁

RESIN-LAMINATED BOARD FOR PRINTED CIRCUIT BOARD, AND ITS MANUFACTURING METHOD例文帳に追加

プリント回路基板用樹脂積層板およびその製造方法 - 特許庁

THERMOCURABLE RESIN COMPOSITION, PREPREG AND LAMINATED BOARD FOR PRINTED CIRCUIT BOARD例文帳に追加

熱硬化性樹脂組成物及びプリプレグ、プリント配線板用積層板 - 特許庁

FLAME RETARDANT RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUIT BOARD AND LAMINATED BOARD例文帳に追加

難燃性樹脂組成物及びプリント配線板用プリプレグ及び積層板 - 特許庁

To reduce the influence of heat generation by a laminated circuit unit, on an electronic circuit board, by separating the laminated circuit unit from the electronic circuit board.例文帳に追加

積層回路ユニットと電子回路基板を離隔して、積層回路ユニットによる電子回路基板への発熱の影響を少なくする。 - 特許庁