無電界メッキ法の英語

そして、基板全体を無電界メッキ溶液５７に浸漬させることにより、メッキ触媒金属５６が析出した領域に無電界メッキ法を利用して金属５８を析出させる（図１（ｆ））。例文帳に追加

The whole of the substrate is immersed in an electroless plating solution 57, and thus a metal 58 is deposited in the region where the plating catalyst metal 56 is deposited using the electroless plating method (Fig.f). - 特許庁

本発明の配線板は、絶縁性基材２上に形成された銅配線部１の上面のみに電気メッキ法で形成された貴金属よりなる電気メッキ皮膜３が配され、電気メッキ皮膜３の上面と銅配線部１の側面か、もしくは銅配線部１の側面のみに無電界メッキ法で形成された金よりなる無電界メッキ皮膜４を有するものである。例文帳に追加

In the wiring board, an electroplating film 3 of noble metal is formed only on the upper surface of a copper wiring part 1 which is formed on an insulating basic material 2 and an electroless plating film 4 of gold is formed only on the upper surface of the electroplating film 3 and the side face of the copper wiring part 1 or on the side face of the copper wiring part 1. - 特許庁

芯材粒子の表面に無電界Ｎｉメッキ法によりＮｉ被膜を設けたＮｉメッキ粒子において、Ｎｉ被膜中の厚み方向のＰ含有量を、芯材粒子側からＮｉ被膜表面側に漸減させる。例文帳に追加

This invention relates to the Ni-plated particles having Ni-films formed on surfaces of core particles by the electroless Ni-plating method, wherein the P content in the thickness direction in the Ni-films is gradually reduced from the core particle side to the Ni-film surface side. - 特許庁

芯材粒子２の表面に無電界Ｎｉメッキ法によりＮｉ被膜３を設けたＮｉメッキ粒子１において、Ｎｉ被膜３中の厚み方向のＰ含有量を、芯材粒子２側よりもＮｉ被膜表面３ｘ側で少なくする。例文帳に追加

The Ni-plated particle 1 having a Ni film 3 plated by an electroless Ni plating method on the surface of a particle core 2, has a less P content in the surface side 3x than in the particle core side 2, along a depth direction of the whole Ni film 3. - 特許庁

また、廃タイヤ由来のゴム炭化微粉末を無電界メッキ液に浸漬させて、前記ゴム炭化微粉末の表面に金属被膜を形成する金属皮膜形成工程を有する電磁波シールド材料の製造方法である。例文帳に追加

The electromagnetic-wave shield material manufacturing method has a metal film forming process for forming the metal film on the surface of the fine carbonized-rubber powder, by immersing the fine carbonized-rubber powder derived from the waste tires into an electroless plating solution. - 特許庁

本発明の方法は、前面板、背面板の封止部に無電界メッキにて金属薄膜を形成しこれを保護層とすることにより電極と封止部材とが直接触れないようにする。例文帳に追加

The plasma display device has a front plate and a rear plate, and a metal film is formed on a sealing portion of the front plate using electroless plating as a protective layer which prevents a direct contact of the sealing member with the electrode. - 特許庁