electric potential distribution processとは 意味・読み方・使い方

Natural electric potential of a field 3 is measured by a natural electric potential measuring device 2 in a first process to prepare electric potential distribution in the field 3.例文帳に追加

第１の工程で、自然電位測定装置２により圃場３の自然電位を測定し、その圃場３の自然電位分布を作成する。 - 特許庁

At the point at which natural electric potential exhibits different value among the natural electric potential distribution obtained by the first process, soil is collected in a second process.例文帳に追加

第２の工程で、第１の工程により得られた自然電位分布のうち自然電位が異なる値を示す地点において土壌を採取する。 - 特許庁

In the device, the difference in potential of distribution of potential on an image carrier is ≥50 V when an image exposure light is consecutively radiated on the image carrier after electrifying and developing process is carried out at developing bias where the effect of the electric field can be markedly received.例文帳に追加

帯電後の像担持体に、像露光光を連続照射した際の、像担持体上での電位分布の電位差が５０Ｖ以上あり、電界の効果を顕著に受け易い現像バイアスで現像処理をおこなう。 - 特許庁

As one embodiment to achieve the objective, a device is provided in which an electric potential distribution in the sample backside is measured during a transportation process of the sample, and based on the results, antistatic degree of the sample is controlled, or the electric potential distribution on the sample surface is estimated or calculated when the sample is in the sample holder or the like.例文帳に追加

上記目的を達成するための一態様として、試料の搬送過程において、試料裏面の電位分布を測定し、その測定に基づいて、試料の除電の程度を制御、又は試料ホルダ等に試料を配置したときの試料表面の電位分布を推定、或いは計算する装置を提案する。 - 特許庁

Breakdown voltage characteristics of the metal partition can be improved in efficiency and cost reduced in, noting the insulating film structure, material process and driving conditions of the metal partition, severing high and low electric-field regions from potential distribution at discharge, and forming a coated thickness of insulating film which corresponds to each region, by justifying the material and process conditions or laminating structure.例文帳に追加

本発明は、メタル隔壁の絶縁皮膜構造・材料プロセス、及び駆動条件に着目し、放電時のポテンシャル分布から高電界領域と低電界領域を切り分け、それぞれの領域に対応する絶縁皮膜の被膜厚さを材料・プロセス条件や積層構造の適正化により形成し、メタル隔壁の耐電圧特性を効率よく向上させ低コスト化することができる。 - 特許庁