multilayer boardsとは 意味・読み方・使い方

The connection member 59 and conductor patterns of the multilayer circuit boards 51, 52 are made of a single material, and the connection member 59 is integrally formed with the conductor patterns of the multilayer circuit boards 51, 52.例文帳に追加

接続部材５９は、両多層回路基板５１，５２の導体パターンと単一の材料で一体に形成されている。 - 特許庁

To improve the characteristics of high speed signal transmissions between multilayer boards.例文帳に追加

多層基板同士の高速信号の伝送特性を向上させること。 - 特許庁

It is then cut into pieces thus obtaining individual multilayer printed wiring boards 10 (C).例文帳に追加

そして、個片に裁断して個々の多層プリント配線板１０を得る（Ｃ）。 - 特許庁

In the connection structure of the high frequency multilayer circuit boards, on a connection for connecting the high-frequency multilayer circuit boards with each other, a signal connection conductor connecting between conductor transmission lines formed in inner layers of both the high frequency multilayer circuit boards, and a ground connection conductor connecting between ground surfaces formed on surface layers of both the high frequency multilayer circuit boards are provided.例文帳に追加

高周波多層回路基板同士の接続部に、それぞれの高周波多層回路基板の内層に形成された導体線路間を接続する信号接続用導体と、それぞれの高周波多層回路基板の表層に形成されたグランド面間を接続するグランド接続用導体とを備える。 - 特許庁

In this way, a smooth multilayer wiring board 50 is obtained by stacking the polished wiring boards P.例文帳に追加

それを積層することにより平滑な多層配線基板５０が得られる。 - 特許庁

To provide the connection structure of circuit boards for constituting a multilayer circuit board by stacking a plurality of the circuit boards.例文帳に追加

複数の回路基板を積層して多層回路基板を構成する為の回路基板の接続構造を提供する。 - 特許庁

When the multilayer board is manufactured, the single-sided conductor pattern film 21 is cut out into the element boards, and the element boards are laminated and pressed as heated.例文帳に追加

多層基板を製造するときには、片面導体パターンフィルム２１を各素板毎に切断し、積層後加熱プレスする。 - 特許庁

A plurality of the unit wiring boards are stacked up, and the laminated wiring boards are collectively pressed from both the upper and the lower surfaces by a vacuum hot press machine to realize the multilayer wiring board (f).例文帳に追加

この単一配線基板を複数枚重ねて、上下両面から真空熱プレス機により一括積層して多層配線板を製造する（ｆ）。 - 特許庁