「copper surface」に関連した英語例文の一覧と使い方(2ページ目) - Weblio英語例文検索

COPPER FOIL, AND SURFACE TREATMENT METHOD THEREFOR例文帳に追加

銅箔およびその表面処理方法 - 特許庁

To provide a surface treatment method for copper improving the chemical resistance of a copper circuit surface and adhesiveness between the copper surface and an insulating resin.例文帳に追加

銅回路表面と絶縁樹脂間の耐薬品性、接着性に優れる銅の表面処理法を提供すること。 - 特許庁

COPPER-PLATED BOARD WITH SURFACE-FINISHED COPPER FOIL AND PRINTED WIRING BOARD THEREOF例文帳に追加

表面処理銅箔付き銅張板及びそのプリント配線板 - 特許庁

A copper tin alloy layer is formed on the surface of the copper particle.例文帳に追加

銅粒子の表面には銅スズ合金層が形成される。 - 特許庁

SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY, AND SOLDERING METHOD例文帳に追加

銅または銅合金の表面処理剤及び半田付け方法 - 特許庁

COPPER FOIL LAMINATE AND METHOD FOR TREATING SURFACE OF COPPER FOIL例文帳に追加

銅箔積層構造体及び銅箔の表面処理方法 - 特許庁

SURFACE-ROUGHENED COPPER FOIL AND ITS PRODUCTION例文帳に追加

表面粗化銅箔とその製造方法 - 特許庁

SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD例文帳に追加

表面処理銅箔並びに回路基板 - 特許庁

SINGLE SURFACE PAPER/PHENOL RESIN/COPPER CLAD LAMINATED SHEET例文帳に追加

片面紙フェノール樹脂銅張積層板 - 特許庁

SURFACE ROUGHENING AGENT FOR COPPER-CONTAINING MATERIAL, METHOD FOR SURFACE-ROUGHENING COPPER-CONTAINING MATERIAL, ADDITIVE FOR PRODUCING SURFACE-ROUGHENING AGENT TO COPPER-CONTAINING MATERIAL AND METHOD FOR PRODUCING SURFACE ROUGHENING AGENT OF COPPER-CONTAINING MATERIAL例文帳に追加

銅含有材料粗面化剤、銅含有材料の粗面化方法、銅含有材料粗面化剤製造用添加剤及び銅含有材料粗面化剤の製造方法 - 特許庁

The surface treatment method of copper and a copper alloy for a printed circuit board comprises performing a surface treatment by bringing the surface treatment solution into contact with the copper and the copper alloy.例文帳に追加

この表面処理液を、銅及び銅合金に接触させて表面処理を行うプリント回路基板用銅及び銅合金の表面処理方法。 - 特許庁

The surface treatment method for copper comprises: a step where a metal nobler than copper is formed on a copper surface; and a step where the copper surface is subjected to oxidation treatment.例文帳に追加

銅表面に銅よりも貴な金属を形成する工程、その後、前記銅表面を酸化処理する工程を有する銅の表面処理方法。 - 特許庁

SURFACE ROUGHENING METHOD AND SURFACE ROUGHENING DEVICE FOR COPPER FOIL例文帳に追加

銅箔の表面粗化方法及び表面粗化装置 - 特許庁

SURFACE-TREATED COPPER POWDER, METHOD FOR MANUFACTURING SURFACE-TREATED COPPER POWDER, AND ELECTROCONDUCTIVE PASTE USING THE SURFACE-TREATED COPPER POWDER例文帳に追加

表面処理銅粉並びにその表面処理銅粉の製造方法及びその表面処理銅粉を用いた導電性ペースト - 特許庁

SURFACE-TREATED COPPER OR COPPER ALLOY PRODUCT, SURFACE TREATMENT METHOD FOR COPPER OR COPPER ALLOY, SURFACE TREATMENT AGENT USED FOR THE SURFACE TREATMENT, AND SURFACE TREATMENT AGENT KIT USED FOR THE SURFACE TREATMENT例文帳に追加

表面処理を施した銅または銅合金製品、銅または銅合金の表面処理方法、該表面処理に用いる表面処理剤、並びに該表面処理に用いる表面処理剤キット - 特許庁

SURFACE TREATED COPPER FOIL FOR MANUFACTURING FLEXIBLE COPPER CLAD LAMINATE, AND FLEXIBLE COPPER CLAD LAMINATE OBTAINED BY USING SURFACE TREATED COPPER FOIL例文帳に追加

フレキシブル銅張積層板製造用の表面処理銅箔及びその表面処理銅箔を用いて得られるフレキシブル銅張積層板 - 特許庁

SURFACE TREATMENT METHOD FOR COPPER, TREATED COPPER AND WIRING BOARD例文帳に追加

銅表面の処理方法および処理した銅並びに配線基板 - 特許庁

SURFACE ADHESION ACCELERATOR FOR COPPER AND COPPER ALLOY, AND ITS USE METHOD例文帳に追加

銅と銅合金の表面接着促進剤及びその使用方法 - 特許庁

ELECTROLYTIC COPPER FOIL AND METHOD FOR ELECTROPOLISHING GLOSSY SURFACE OF ELECTROLYTIC COPPER FOIL例文帳に追加

電解銅箔及び電解銅箔光沢面の電解研磨方法 - 特許庁

COPPER SURFACE TREATMENT LIQUID SET, SURFACE TREATMENT METHOD FOR COPPER USING THE SAME, COPPER, WIRING BOARD AND SEMICONDUCTOR PACKAGE例文帳に追加

銅表面処理液セット、これを用いた銅の表面処理方法、銅、配線基板および半導体パッケージ - 特許庁

SOLAR CELL USING SURFACE-ROUGHENED COPPER PLATE例文帳に追加

表面粗化銅板を用いた太陽電池 - 特許庁

FORMING METHOD OF COPPER SURFACE PROTECTION FILM AND PROCESSING METHOD OF COPPER SURFACE WHERE PROTECTION FILM IS FORMED例文帳に追加

銅表面保護膜の形成方法と保護膜の形成された銅表面の処理方法 - 特許庁

SURFACE TREATMENT SOLUTION AND SURFACE TREATMENT METHOD OF COPPER AND COPPER ALLOY FOR PRINTED CIRCUIT BOARD例文帳に追加

プリント回路基板用銅及び銅合金の表面処理液と表面処理方法 - 特許庁

a method of hardening the surface of copper, called cyanide process 例文帳に追加

青化法という,銅の表面硬化法 - EDR日英対訳辞書

METHOD FOR MANUFACTURE OF ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL MANUFACTURED BY THE METHOD, SURFACE-TREATED COPPER FOIL MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL OR SURFACE-TREATED COPPER FOIL例文帳に追加

電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板 - 特許庁

COPPER FOIL WITH CARRIER SHEET, MANUFACTURING METHOD OF COPPER FOIL WITH CARRIER SHEET, SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET, AND COPPER LAMINATED PLATE USING THE SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET例文帳に追加

キャリアシート付銅箔、キャリアシート付銅箔の製造方法、キャリアシート付表面処理銅箔及びそのキャリアシート付表面処理銅箔を用いた銅張積層板 - 特許庁

The surface-modified copper member has, on the surface of a substrate made of copper or a copper alloy, a carbon-doped oxide layer comprising a carbon-doped copper oxide layer or a carbon-doped copper alloy oxide layer.例文帳に追加

銅又は銅合金からなる基体の表面に、炭素ドープされた酸化銅又は炭素ドープ銅合金酸化物層からなる炭素ドープ酸化物層を具備する。 - 特許庁

ELECTROLYTIC COPPER FOIL, SURFACE-TREATED ELECTROLYTIC COPPER FOIL OBTAINED BY USING THE ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE USING THE SURFACE-TREATED ELECTROLYTIC COPPER FOIL, AND PRINTED CIRCUIT BOARD例文帳に追加

電解銅箔、その電解銅箔を用いて得られた表面処理電解銅箔、その表面処理電解銅箔を用いた銅張積層板及びプリント配線板 - 特許庁

In this surface treating method for copper or copper alloys, the surface of copper or a copper alloy is roughened and is then formed with copper oxide of 2 to 20 mg/dm2.例文帳に追加

銅または銅合金の表面を粗化し、ついでこの表面に２〜２０ｍｇ／ｄｍ^2の酸化銅を形成することを特徴とする銅または銅合金の表面処理法。 - 特許庁

Disclosed is the surface treatment method for the copper or the copper alloy, with which a surface treatment agent comprising an imidazole compound is brought into contact with the surface of the copper or the copper alloy, thus the rust preventive film is formed on the copper or the copper alloy.例文帳に追加

イミダゾール化合物を含む表面処理剤を銅又は銅合金表面に接触させることで、当該銅又は銅合金に防錆皮膜を形成する銅又は銅合金の表面処理方法。 - 特許庁

METHOD FOR SURFACE TREATING OF COPPER FOIL AND FOR MANUFACTURING COPPER-CLAD LAMINATED BOARD例文帳に追加

銅箔の表面処理方法及び銅張積層板の製造方法 - 特許庁

The negative electrode collector includes copper foil, and a rustproof layer formed on a surface of the copper foil.例文帳に追加

銅箔と、銅箔表面に形成された防錆層を備える。 - 特許庁

COMPOSITION FOR CONDITIONING COPPER SURFACE AND SURFACE TREATMENT METHOD例文帳に追加

銅の表面調整組成物および表面処理方法 - 特許庁

SURFACE-TREATED COPPER FOIL, SURFACE-TREATED COPPER FOIL WITH EXTREMELY THIN PRIMER RESIN LAYER, AND METHOD OF MANUFACTURING THE SURFACE-TREATED COPPER FOIL AND METHOD OF MANUFACTURING THE SURFACE-TREATED COPPER FOIL WITH EXTREMELY THIN PRIMER RESIN LAYER例文帳に追加

表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法 - 特許庁

TREATMENT METHOD OF COPPER SURFACE AND WIRING BOARD例文帳に追加

銅表面の処理方法及び配線基板 - 特許庁

SURFACE TREATED COPPER FOIL, AND ITS PRODUCTION METHOD例文帳に追加

表面処理銅箔及びその製造方法 - 特許庁

To provide a surface treatment method of a copper foil improving an adhesive property between the surface of copper and a resin and a copper-clad laminated board made by using the surface treated copper foil.例文帳に追加

銅の表面と樹脂との接着性を向上させうる銅箔の表面処理方法とその表面処理銅箔を用いた銅張積層板に関する。 - 特許庁

ACID DEGREASING AGENT USED FOR PRETREATMENT OF ELECTROLYTIC COPPER PLATING TO SURFACE OF COPPER OR COPPER ALLOY, AND ELECTROLYTIC COPPER PLATING METHOD TO SURFACE OF COPPER OR COPPER ALLOY PRETREATED USING THE ACID DEGREASING AGENT例文帳に追加

銅又は銅合金表面への電気銅めっきの前処理に用いる酸性脱脂剤及びその酸性脱脂剤を用いて前処理した銅又は銅合金表面への電気銅めっき方法 - 特許庁

To provide a surface treated copper foil enhancing adhesiveness when gluing together by hot press processing of the surface treated copper foil having a silane coupling agent treated layer and a resin base material, a manufacturing method of the surface treated copper foil, and a copper clad laminate using the surface treated copper foil.例文帳に追加

シランカップリング剤処理層を備える表面処理銅箔と樹脂基材との熱間プレス加工し張り合わせたときの密着性を向上させる表面処理銅箔の提供を目的とする。 - 特許庁

SURFACE TREATED COPPER FOIL, COPPER CLAD LAMINATE OBTAINABLE USING THE SURFACE TREATED COPPER FOIL, AND PRINTED CIRCUIT BOARD OBTAINABLE USING THE COPPER CLAD LAMINATE例文帳に追加

表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 - 特許庁

SURFACE-TREATED COPPER FOIL, METHOD FOR MANUFACTURING THE SAME AND COPPER-CLAD LAMINATE例文帳に追加

表面処理銅箔およびその製造方法ならびに銅張積層板 - 特許庁

SURFACE-TREATED COPPER FOIL AND METHOD OF MANUFACTURING THE SAME例文帳に追加

表面処理銅箔及びその製造方法 - 特許庁

SURFACE TREATED COPPER FOIL AND METHOD OF MANUFACTURING THE SAME例文帳に追加

表面処理銅箔及びその製造方法 - 特許庁

SURFACE-TREATED COPPER FOIL, AND METHOD FOR PRODUCTION THEREOF例文帳に追加

表面処理銅箔及びその製造方法 - 特許庁

METHOD OF CONTROLLING CONCENTRATION OF SURFACE TREATMENT SOLUTION FOR COPPER OR COPPER ALLOY, AND SURFACE ROUGHENING APPARATUS USING THE SAME例文帳に追加

銅または銅合金の表面処理液の濃度管理方法及びこれを用いた粗面化装置 - 特許庁