insulating platesとは 意味・読み方・使い方

This is made to be a heat insulating and three-dimensional module by interposing and installing a heat insulating material or a separating material between rear faces of the logic plates.例文帳に追加

ロジックプレートの背面間に断熱材又は離隔材を介設して断熱立体モジュールとする。 - 特許庁

By heating/pressing the surface plates 1 and 2 and the heat insulating material 3 by hot plates 5 and 6, the surface plates 1 and 2 and the heat insulating material 3 are curved and adhered to each other integrally.例文帳に追加

熱盤５、６により表面板１、２と断熱材３とを加熱加圧することによって、表面板１、２と断熱材３とを湾曲させると共に一体的に接着する。 - 特許庁

A pitch b between the SiC-made heat insulating plates 72 and 72 is made larger than a pitch d between the quartz-made heat insulating plates 70 and 70 in the first and the second heat insulating parts 50 and 52.例文帳に追加

第１の断熱部５０及び第２の断熱部５２において、ＳｉＣ製断熱板７２，７２間のピッチｂを石英製断熱板７０，７０間のピッチｄよりも大きくする。 - 特許庁

An insulating member 5 is folded into two, and fitted to application electrode plates 2-2.例文帳に追加

絶縁部材５を二つ折りにして印加電極板２−２に取り付ける。 - 特許庁

This battery pack dissipates heat of each lead plates 3 separated at the insulating gap 5 by each of heat radiating plates 4 having the insulating gap 5 separating it.例文帳に追加

この電池パックは、絶縁隙間５で分離してなる各々のリード板３を、絶縁隙間５で分離してなる各々の放熱プレート４で放熱している。 - 特許庁

A heat insulating material 3 is arranged between two metal surface plates 1 and 2.例文帳に追加

金属製の二枚の表面板１、２の間に断熱材３を配置する。 - 特許庁

A pair of electrode plates 2 are press-bonded to both surfaces as electrode surfaces of a semiconductor device 1, a pair of insulating plates 3 are press-bonded to the outsides of the pair of electrode plates 2, and a pair of heat-radiating plates 4 are press-bonded to the outsides of the pair of insulating plates 3.例文帳に追加

半導体素子１の電極面としての両面は一対の電極板２にて圧接され、一対の電極板２の外側は一対の絶縁板３にて圧接され、一対の絶縁板３の外側は一対の放熱板４にて圧接されている。 - 特許庁

At both ends of the stack 14 in the stacking direction, terminal plates 16a, 16b, insulating plates 18a, 18b, and end plates 20a, 20b are arranged.例文帳に追加

積層体１４の積層方向両端には、ターミナルプレート１６ａ、１６ｂ、絶縁プレート１８ａ、１８ｂ及びエンドプレート２０ａ、２０ｂが配設される。 - 特許庁