perforation plateとは 意味・読み方・使い方

Thereby, a highly accurate stencil printing plate base paper with fine perforation provided can be produced by perforation plate making so as to achieve printing with a high printing quality.例文帳に追加

その結果、微細な穿孔８が穿設された高精細な孔版原紙を穿孔製版して印刷品質の高い印刷を達成する。 - 特許庁

The key plate portion is provided with perforation for discarding or a V groove.例文帳に追加

捨て板部分は割り捨て用のミシン目あるいはＶ溝が施されている。 - 特許庁

When the swingable plate is lifted, the upper surface and the side surface are broken from an upper perforation line 14b and a side surface perforation line 13b.例文帳に追加

揺動板を持上げると、上面および側面が、上面破断線１４ｂおよび側面破断線１３ｂから破断する。 - 特許庁

Perforation is made at a prescribed location of a white reflecting sheet and a crimping press is made and, by forming a folding line using concurrently the crimping press having a perforation and the crimping press without the perforation, the reflecting plate is formed.例文帳に追加

白色反射シートの所要の個所にミシン目を入れ、しぼ付押を行い、ミシン目とミシン目無しのしぼ付押の併用による折目を形成し、反射板を作製する。 - 特許庁

In this grinding device, rotation of a motor 11 mounted on a main body box 12 is transmitted to a longitudinal perforation blade holder 4 fixed by pillow blocks 7 through a pulley 10, a belt 9 and a pulley 8 to rotate a circular longitudinal perforation blade 1 fixed to the longitudinal perforation blade holder 4 with a perforation blade press plate 2 and a nut 3.例文帳に追加

本体箱１２につけたモーター１１の回転をプーリＢ，１０からベルト９を通りプーリＡ，８はピローブロツク７で固定される縦ミシン刃ホルダー４を回転しこれに，ミシン刃押さえ板２とナツト３で固定する円型形状の縦ミシン刃１に伝える。 - 特許庁

The camera is constituted in such a manner that a part of a photographic film 102 between one perforation and the next perforation is alternately disposed into between a metal plate 11 and a pressurizing plate 13 to detect changes in the electrostatic capacitance and to count the perforations 103.例文帳に追加

金属片１１と圧板１３との間にパーフォレーションと次のパーフォレーションとの間の写真フィルム１０２の部分を交互に介在させ、静電容量の変化を検出してパーフォレーション１０３をカウントする。 - 特許庁

Accordingly, charging of the perforation scraps S can be eliminated by a route of the perforation scraps S→the conductive member 22→a lower guide plate 12→a post-processor body.例文帳に追加

従って、穿孔カスＳ→導電性部材２２→下ガイド板１２→後処理装置本体の経路により、穿孔カスＳの帯電を除去することが可能になる。 - 特許庁