加圧封止の英語

貫通孔１２ｃ内に封止材１６を配設した後、先端がピン状の加圧手段１９を用い、封止材１６を加圧変形させる。例文帳に追加

A sealing member 16 is disposed within a through-hole 12c, and the sealing member 16 is then pressurized and deformed using a pressurizing means 19 having a pin-like distal end. - 特許庁

従来の封止方法では、封止樹脂を熱硬化させるために長時間の加熱を要し、熱可塑性樹脂による封止でも真空加圧やオートクレーブ加圧などの長時間プロセスを行う。例文帳に追加

To solve such problems that the conventional sealing method requires heating for long period of time for thermally curing a sealing resin and, even in sealing with a thermoplastic resin, processes for long period of time, such as vacuum pressurization and autoclave pressurization, are performed. - 特許庁

圧縮金型５４を上昇させ、樹脂を溶融・加圧して被成形品１を封止する。例文帳に追加

The compression mold 54 is elevated, resin is melted/pressurized and the molded article 1 is sealed. - 特許庁

信頼性の高い封止を可能とする粉末加圧焼結用容器の脱気封止方法を提供する。例文帳に追加

To provide a method for degassing and sealing a vessel for powder pressurized sintering with which the sealing having high reliability can be obtained. - 特許庁

液晶注入後の封止を行う工程において、加圧状態にて封止材を注入口部分に塗布した後、第１の減圧を行って前記封止材を注入口内に引き込み、その後、前記封止材を硬化させた後、第２の減圧により加圧を全解除する。例文帳に追加

In the process of sealing after a liquid crystal is injected, after the sealing material is applied on the injection port in a pressurized state, first pressure reduction is carried out to suck the sealing material into the inside of the injection port, then the sealing material is hardened and then the whole pressure is released by second pressure reduction. - 特許庁

固体撮像装置の封止（接着）工程において、加熱処理の熱による封止空間内部の圧力上昇を防止する。例文帳に追加

To prevent the pressure from increasing in a sealed space by the heat of heat treatment in a sealing (adhesion) process of a solid-state image pickup device. - 特許庁

セルギャップ調整装置、加圧封止装置及び液晶表示装置の製造方法例文帳に追加

CELL GAP ADJUSTING DEVICE, PRESSURE-SEALING DEVICE AND MANUFACTURING METHOD OF LIQUID CRYSTAL DISPLAY DEVICE - 特許庁

そして、第１の所定温度の下に支持基板２１と封止基板２５との間に封止電圧を印加し、支持基板２１に封止基板２５を陽極接合する。例文帳に追加

Then, a sealing voltage is impressed between the supporting substrate 21 and a sealing substrate 25 under a first prescribed temperature, and the sealing substrate 25 is anode-joined to the supporting substrate 21. - 特許庁