均磨の英語

被研磨板１の研磨面の周辺領域で小さくなる研磨速度を大きくし、研磨面の研磨速度の面内均一性を向上する。例文帳に追加

To improve uniformity of polishing speed in the surface of a plate 1 to be polished by increasing the polishing speed which decreases in the peripheral region of the surface. - 特許庁

均一性の高い研磨および高速研磨を可能とする研磨装置を提供する。例文帳に追加

To provide a polishing apparatus which can perform a highly uniform polishing operation and a high speed polishing operation. - 特許庁

高い研磨均一度を有するウェーハ研磨装置及びウェーハ研磨方法を提供する。例文帳に追加

To provide a wafer-polishing apparatus having a high degree of uniformity of polishing, and to provide a wafer-polishing method. - 特許庁

優れた研磨レートの面内均一性が得られる研磨装置及び研磨方法を提供する。例文帳に追加

To provide a polishing apparatus and method which can obtain an in-plane uniformity with an excellent polishing rate. - 特許庁

被研磨対象物の被研磨面における研磨中の圧力分布を均一化し、被研磨面全面において均一に研磨可能な研磨装置および研磨方法を提供する。例文帳に追加

To provide a polishing device and a polishing method for making uniform distribution of pressure in the process of polishing on the surface to be polished of an object to be polished so that the whole surface of the surface to be polished can be uniformly polished. - 特許庁

研磨液を被研磨材の被研磨面に供給して研磨材により研磨を行う研磨装置であって、被研磨面の研磨液の分布を均一にする送風手段７（送風口）を設ける。例文帳に追加

In this polishing device to polish by a polishing material by feeding the polishing liquid to the polished surface of the polished material, an air blasting means 7 (a blower tube) to make the distribution of the polishing liquid on the polished surface even, is provided. - 特許庁

被研磨面の研磨痕を抑制し、且つ、被研磨面全体に亘り研磨量を均一化することができる研磨布、並びに、該研磨布を用いたウェーハの片面研磨方法および片面研磨装置の提供。例文帳に追加

To provide an abrasive cloth suppressing a polishing trace on a polished surface and equalizing the amount of polishing over the entire polished surface; and method and device for polishing a single side of a wafer by using the abrasive cloth. - 特許庁

被研磨物と接触させて、被研磨物を研磨する研磨層２１を有し、その研磨層２１は領域ごとに密度が異なる研磨パッド１を用いることによって、被研磨物全面において研磨レートを均一にすることができる。例文帳に追加

It is possible to polish the overall surface of a grinding article uniformly at a polishing rate by using the polishing pad 1 having a polishing layer 21 to polish the polishing article by making it contact with the polishing article and density of which is different in each region. - 特許庁